Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices

A method comprising:

• producing a sheet of an inorganic binder and embedded wavelength converting material;
• producing a plurality of separate individual wavelength converting elements from the sheet;
• wherein the inorganic binder is a glass and wherein producing a sheet of an inorganic binder and embedded wavelength converting material comprises:
• providing a mixture of wavelength converting material and powdered glass;
• inserting the mixture in a crucible;
• inserting the crucible into a furnace heated between 800° C. and 950° C. to produce a melt;
• homogenizing the melt in the furnace;
• pouring the homogenized melt onto a plate;
• and
• pressing the melt on the plate to produce the sheet.

A method comprising:

• producing a sheet of an inorganic binder and embedded wavelength converting material;
• and
• producing a plurality of separate individual wavelength converting elements from the sheet;
• and
• bonding one of the plurality of wavelength converting elements to a semiconductor light emitting device die;
• wherein the wavelength converting element has an indentation, the method further comprising fitting the semiconductor light emitting device die into the indentation of the wavelength converting element.

A method comprising:

• producing a sheet of a binder and embedded wavelength converting material;
• producing a plurality of separate individual wavelength converting elements from the sheet;
• measuring light conversion properties of the plurality of wavelength converting elements;
• and
• grouping and storing the wavelength converting elements based on the light conversion properties.

A method comprising:

• producing a sheet of a binder and embedded wavelength converting material;
• producing a plurality of separate individual wavelength converting elements from the sheet;
• measuring the light conversion properties of the plurality of wavelength converting elements;
• grouping and storing the wavelength converting elements based on the light conversion properties;
• providing a semiconductor light emitting device die;
• measuring the range of wavelengths emitted by the semiconductor light emitting device die;
• selecting one of the plurality of wavelength converting elements based on the range of wavelengths emitted by the semiconductor light emitting device die and the light conversion properties of the wavelength converting element;
• and
• bonding the selected wavelength converting element to the semiconductor light emitting device die;
• wherein the wavelength converting element has an indentation, the method further comprising fitting the semiconductor light emitting device die into the indentation of the wavelength converting element.