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US 7,551,442 B2Granted
Embedded heat pipe in a hybrid cooling system
AssigneeNVIDIA Corporation
InventorZoran Stefanoski
Life of this patent
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AssigneeNVIDIA Corporation
InventorZoran Stefanoski
Estimating the term…
One embodiment of a system for cooling a heat-generating device includes a base adapted to be coupled to the heat-generating device, a housing coupled to the base, a liquid channel formed between the base and the housing, where a heat transfer liquid may be circulated through the liquid channel to remove heat generated by the heat-generated device, and a heat pipe disposed within the liquid channel, where the heat pipe increases the heat transfer surface area to which the heat transfer liquid is exposed. Among other things, the heat pipe advantageously increases the heat transfer surface area to which the heat transfer liquid is exposed and efficiently spreads the heat generated by the heat-generating device over that heat transfer surface area. The result is enhanced heat transfer through the liquid channel relative to prior art cooling systems.
A system for cooling a heat-generating device, the system comprising:
A computer system configured with a cooling system, the computer system comprising:
Dependencies are inferred from the claim text.