Stacked redistribution layer (RDL) die assembly package

A stacked redistribution layer (RDL) die assembly package comprising:

• a first level RDL die assembly comprising:
• a first die comprising bond pads;
• a first fan out support extending outwardly from sides of the first die, the fan out support abutting and entirely enclosing all sides of the first die;
• first traces electrically connected to the bond pads, the first traces being supported by the first fan out support;
• a substrate comprising traces on a first surface of the substrate, the first level RDL die assembly being directly mounted to the substrate;
• first level bond wires electrically connecting terminals of the first traces to the traces of the substrate;
• and
• a second die mounted to the first level RDL die assembly, the second die comprising bond pads on a first surface of the second die.

A stacked redistribution layer (RDL) die assembly package comprising:

• a first level RDL die assembly comprising:
• a first die comprising bond pads;
• a first fan out support extending outwardly from sides of the first die, the fan out support abutting and entirely enclosing all sides of the first die;
• first traces electrically connected to the bond pads, the first traces being supported by the first fan out support;
• a second die mounted to the first level RDL die assembly, the second die comprising bond pads on a first surface of the second die;
• a substrate comprises traces on a first surface of the substrate, the first level RDL die assembly being directly mounted to the substrate;
• and
• first level bond wires electrically connecting terminals of the first traces to the traces of the substrate.