Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
AssigneeE. I. Du Pont de Nemours and Company
InventorsCarl B. Wang, Shih-Ming Kao, Yu-Cheng Lin, Jaw-Shin Cheng
Life of this patent
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Abstract
The present invention provides LTCC (low temperature co-fired ceramic) tape compositions and demonstrates the use of said LTCC tape(s) in the formation of Light-Emitting Diode (LED) chip carriers and modules for various lighting applications. The present invention also provides for the use of (LTCC) tape and LED modules in the formation of lighting devices including, but not limited to, LED devices, High Brightness (HB) LED backlights, display-related light sources, automotive lighting, decorative lighting, signage and advertisement lighting, and information display lighting.
Claims12
A method of forming a light emitting diode chip carrier comprising:
- providing two or more low temperature co-fired ceramic (LTCC) tape layers;
- (a) each tape layer comprising 40 to 70 weight percent glass frit;
- (b) 30 to 60 weight percent refractory ceramic filler;
- (c) 0 to 10 weight percent of one or more inorganic pigments;
- dispersed in
- (d) an organic medium, wherein said refractory ceramic filler and said inorganic pigment have a refractive index in the range of 1.5 to 3.5 and said refractory ceramic filler has a flexural strength of at least 150 MPa;
- forming one or more cavities in said tape layers;
- providing at least two electrical vias and at least one thermal via in said tape layers;
- wherein said LTCC tape layers provide a desired circuit pattern and said circuit pattern is electrically connected through said electrical vias, thus, forming a functioning light emitting diode chip carrier.
A method of forming a light emitting diode module comprising:
- providing two or more LTCC tape layers;
- forming one or more cavities in said tape layers;
- providing at least two electrical vias and at least one thermal via in said tape layers;
- providing at least one functioning light emitting diode chip;
- wherein said LTCC tape layers provide a desired circuit pattern and said circuit pattern is electrically connected through said electrical vias, thus, forming a functioning chip carrier and wherein at least one functioning light emitting diode chip is mounted to said chip carrier, wherein at least one thermal via is connected to a heat sink and wherein said thermal via dissipates heat released from said functioning light emitting diode chip through its connection to said heat sink and wherein said heat sink comprises a material selected from Al, BeO, AlN, and plated alloys of the group comprising Cu—W, Cu—Mo, Cu—Mo—Cu, and Al—SiC.
A light emitting diode module having two or more LTCC tape layers;
- each tape layer comprising 40 to 70 weight percent glass frit;
- 30 to 60 weight percent refractory ceramic filler;
- 0 to 10 weight percent of one or more inorganic pigments;
- dispersed in an organic medium, wherein said refractory ceramic filler and said inorganic pigment have a refractive index in the range of 1.5 to 3.5 and said refractory ceramic filler has a flexural strength of at least 150 MPa;
- having one or more cavities in said tape layers;
- having at least two electrical vias and at least one thermal via in said tape layers;
- having at least one functioning light emitting diode chip;
- wherein said LTCC tape layers provide a desired circuit pattern and said circuit pattern is electrically connected through said electrical vias, thus, forming a functioning chip carrier and wherein at least one functioning light emitting diode chip is mounted to said chip carrier and wherein at least one thermal via is connected to a heat sink and wherein said thermal via dissipates heat released from said functioning light emitting diode chip through its connection to said heat sink.
Dependencies are inferred from the claim text.