Method of producing a complex structure by assembling stressed structures
AssigneeCommissariat a l'Energie Atomique
InventorsFranck Fournel, Hubert Moriceau, Phillippe Montmayeul
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Abstract
The invention relates to a method of producing a complex microelectronic structure, in which two basic microelectronic structures are assembled at the two respective connecting faces thereof. The invention is characterized in that, before assembly, a difference is created in the tangential stress state between the two faces to be assembled, said difference being selected such as to produce a pre-determined stress state within the assembled structure under given conditions in relations to the assembly conditions.
Claims36
A method of producing a complex structure wherein respective connecting faces of two structures are brought into contact and assembled, the method comprising applying mechanical forces to each of the two structures before bringing them into contact to curve the two structures so that the connecting faces are respectively concave and convex and to create a tangential stress state difference, wherein the tangential stress state difference creates a predetermined stress state within the complex structure under subsequent processing conditions relative to the assembly conditions.
A method of producing a complex structure comprising:
- providing two structures;
- applying mechanical forces to each of the two structures so that the two structures have respective concave and convex faces;
- bringing the concave and convex faces into contact and assembling the faces, such that there is a tangential stress difference between the faces during assembling;
- and
- removing the mechanical forces,
- whereby a predetermined stress state exists between the two assembled structures after removing the mechanical forces.
A method of producing a complex structure wherein respective connecting faces of two structures having different coefficients of thermal expansion or different lattice constants, or both, are brought into contact and assembled, the method comprising:
- applying mechanical forces to each of the two structures before bringing them into contact to curve the two structures and to create a tangential stress state difference,
- wherein the tangential stress state difference causes a predetermined stress state within the complex structure configured to provide a surface having a predetermined lattice parameter under subsequent processing conditions relative to the assembly conditions.
Dependencies are inferred from the claim text.