Solid state imaging device and method for manufacturing the same
AssigneePanasonic Corporation
InventorsToshihiro Kuriyama, Atsushi Tomozawa
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Abstract
A plurality of light receiving elements are arranged in a matrix with uniform space therebetween in a light receiving region defined on a semiconductor substrate. A plurality of read-out electrodes are formed on the semiconductor substrate in an arrangement corresponding to the light receiving elements to read charges generated by the light receiving elements, a light shield film having openings positioned above the light receiving elements is formed to cover the read-out electrodes, first optical waveguides are formed in the openings above the light receiving elements and second optical waveguides are formed on the light shield film. The second optical waveguides are in the form of dots, stripes or a grid when viewed in plan.
Claims5
A solid state imaging device including a plurality of light receiving elements arranged in a substrate such that a substrate region is defined between adjacent light receiving elements, the solid state image device comprising:
- first optical waveguides formed above the light receiving elements;
- second optical waveguides formed over the respective substrate regions;
- and
- condenser lenses provided in the same arrangement as the light receiving elements and the first optical waveguides when viewed in plan, wherein
- the second optical waveguides are positioned between the condenser lenses when viewed in plan.
Dependencies are inferred from the claim text.