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US 7,548,428 B2Granted
Computer device heat dissipation system
AssigneeHewlett-Packard Development Company, L.P.
InventorsJeffrey A. Lev, Mark S. Tracy
Life of this patent
Estimating the term…
Abstract
A computer device heat dissipation system comprising a heat exchanger having a plurality of fins connected to a heat pipe, at least one of the plurality of fins comprises at least one aperture to enable an airflow to pass therethrough.
Claims20
A computer device heat dissipation system, comprising:
- a heat exchanger having a plurality of fins connected to a heat pipe, the plurality of fins including rows having a non-planar configuration that alternate and spaced apart with rows having a planar configuration, and at least one of the plurality of fins comprises at least one aperture to enable an airflow to pass therethrough.
A method of manufacturing a computer device heat dissipation system, comprising:
- providing a heat exchanger having a plurality of fins in a computer device, at least one of the plurality of fins comprising at least one aperture to enable an airflow to pass therethrough;
- and
- configuring the plurality of fins having two different alternating planar and non-planar configurations that are spaced apart.
A computer device heat dissipation system, comprising:
- at least one fan configured to generate an airflow across a plurality of fins of a heat exchanger, the plurality of fins having an alternating arrangement of fin configuration patterns, wherein the alternating arrangement of fin configuration patterns comprise a planar conflagration pattern alternating and spaced apart with a non-planar configuration pattern.
Dependencies are inferred from the claim text.