Apparatus and docking station for cooling of computing devices
AssigneeIntel Corporation
InventorRajiv K. Mongia
Life of this patent
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Abstract
An apparatus with some embodiments is described having cooling capabilities for a computing device. In some embodiments, the apparatus may include a thermoelectric component (TEC) to transfer thermal energy with a first heat exchanger, through a heat attach and heat pipe, to or from the TEC, and then with a second heat exchanger. In some embodiments, the apparatus may include a second heat attach and a second heat pipe between the second heat exchanger and the TEC. Furthermore, in some embodiments, the apparatus may be at a docking station, where the docking station may connect with the computing device. Other embodiments are described.
Claims14
An apparatus comprising:
- a thermoelectric component to transfer thermal energy when an electric current is applied to the thermoelectric component;
- a first heat attach coupled to the thermoelectric component to allow for the transfer of thermal energy through the thermoelectric component;
- a first heat pipe coupled to the first heat attach to allow for the transfer of thermal energy through the first heat attach;
- a first heat exchanger coupled to the first heat pipe to allow for the transfer thermal energy through the first heat pipe, wherein the first heat exchanger can receive thermal energy from a first airflow and produce a second airflow;
- and
- a second heat exchanger coupled to the thermoelectric component to receive thermal energy from the thermoelectric component, wherein the second heat exchanger can dissipate thermal energy to a third airflow.
A docking station, comprising:
- a housing to provide for one or more airflows;
- a docking station engager at the housing to engage a connection between the docking station and a computing device;
- and
- an apparatus at the housing to provide cooling to the computing device when engaged with the docking station, wherein the apparatus includes a thermoelectric component to transfer thermal energy when an electric current is applied to the thermoelectric component;
- a first heat attach coupled to the thermoelectric component to allow for the transfer of thermal energy through the thermoelectric component;
- a first heat pipe coupled to the first heat attach to allow for the transfer of thermal energy through the first heat attach;
- a first heat exchanger coupled to the first heat pipe to allow for the transfer thermal energy through the first heat pipe, wherein the first heat exchanger can receive thermal energy from a first airflow and produce a second airflow;
- and
- a second heat exchanger coupled to the thermoelectric component to receive thermal energy from the thermoelectric component, wherein the second heat exchanger can dissipate thermal energy to a third airflow.
An apparatus comprising:
- a thermoelectric component to transfer thermal energy when an electric current is applied to the thermoelectric component;
- a first heat attach coupled to the thermoelectric component to allow for the transfer of thermal energy through the thermoelectric component;
- a first heat pipe coupled to the first heat attach to allow for the transfer of thermal energy through the first heat attach;
- a first heat exchanger coupled to the first heat pipe to allow for the transfer thermal energy through the first heat pipe, wherein the first heat exchanger can dissipate thermal energy to a first airflow and produce a second airflow;
- and
- a second heat exchanger coupled to the thermoelectric component to transfer thermal energy to the thermoelectric component, wherein the second heat exchanger can receive thermal energy from a third airflow.
Dependencies are inferred from the claim text.