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US 7,548,422 B2Granted
Socket having fan
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorWayne Hsieh
Life of this patent
Estimating the term…
Abstract
A socket for a semiconductor package comprises an insulating base containing a plurality of contacts, a floating board received in the insulating base, a plurality of spring members located between the insulating base and the floating board, a bottom cover pivotally assembled to an end of the insulating base, a top cover pivotally assembled to an edge of the bottom cover, a pressing board retained to the bottom cover, a heat sink module disposed on the bottom cover, and a fan mounted on the top cover.
Claims13
A socket comprising:
- an insulating base receiving a plurality of contacts and defining a receiving space;
- a bottom cover pivotally assembled to the insulating base;
- and
- a top cover pivotally assembled to the bottom cover and covering the bottom cover, the top cover having supporting portions upwardly protruding from sides thereof.
1 more element
A socket for a semiconductor package comprising:
- an insulating base receiving a plurality of contacts and defining a receiving space;
- a bottom cover pivotally assembled to an end of the insulating base thereof;
- a top cover pivotally assembled to an edge of the bottom cover and covering the bottom cover;
- and
- a fan mounted on the top cover.
2 more elements
A socket assembly comprising:
- an insulating base receiving a plurality of contacts and defining a receiving space;
- a bottom cover having one end linked to an end of the insulating base thereof;
- a top cover linked to the other end of the bottom cover and covering the bottom cover;
- and
- a fan mounted on the top cover with a distance so as to allow a heat sink to be located thereunder under a condition that both the top cover and the bottom cover respectively define aligned central openings through which said heat sink and an associated electronic package extend.
2 more elements
Dependencies are inferred from the claim text.