Module with embedded semiconductor IC and method of fabricating the module

A multilayered module with one or more interconnecting wiring board, comprising:

• a first circuit board wiring pattern;
• an integrated circuit having bumps formed on its main surface;
• a first resin layer formed in contact with the first circuit board wiring pattern and in contact with a back surface and at least part of a peripheral surface of the integrated circuit;
• a second resin layer formed in at least partial contact with at least side surfaces of the bumps;
• post electrodes embedded in at least the first resin layer and the second resin layer;
• and
• a second circuit board wiring pattern in contact with the second resin layer, wherein the first resin layer and the second resin layer are formed of different materials, wherein a material forming the second resin layer has a higher Q value than a material forming the first resin layer.

A multilayered module with one or more interconnecting wiring board, comprising:

• a first circuit board wiring pattern;
• an integrated circuit having bumps formed on its main surface;
• a first resin layer formed in contact with the first circuit board wiring pattern and in contact with a back surface and at least part of a peripheral surface of the integrated circuit;
• a second resin layer formed in at least partial contact with at least side surfaces of the bumps;
• and
• a second circuit board wiring pattern in contact with the second resin layer, wherein the first resin layer and the second resin layer are formed of different materials, wherein a material forming the second resin layer has a higher Q value than a material forming the first resin layer, wherein the second resin layer includes a material typically used to fabricate printed circuit boards so as to include aramid fiber, glass cloth, or non-woven fabric.