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US 7,547,974 B2Granted
Wiring substrate with improvement in tensile strength of traces
AssigneePowertech Technology Inc.
InventorWen-Jeng Fan
Life of this patent
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Abstract
A wiring substrate with tensile-strength enhanced traces primarily comprises a core layer, a plurality of connecting pads, a plurality of traces, and a solder resist where the connecting pads and the traces are disposed on a top of the core layer. The solder resist is formed over the top of the core layer to cover the traces with the connecting pads partially or completely exposed. Furthermore, the traces have I-shaped cross sections to enhance the tensile strength of the traces.
Claims15
A wiring substrate comprising:
- a core layer;
- a plurality of connecting pads disposed on a top of the core layer;
- a plurality of traces disposed on the top of the core layer and connecting the connecting pads;
- and
- a solder resist formed over the top of the core layer to cover the traces with the connecting pads exposed;
- wherein the traces have I-shaped cross sections.
3 more elements
A wiring substrate comprising:
- a core layer;
- a plurality of connecting pads disposed on a top of the core layer;
- a plurality of traces disposed on the top of the core layer and connecting to the connecting pads;
- and
- a solder resist formed over the top of the core layer to cover the traces with the connecting pads exposed;
- wherein each trace has a top surface, a bottom surface, and two indentation sides, the indentation sides and the top surfaces are covered by the solder resist.
3 more elements
Dependencies are inferred from the claim text.