Package and package module of the package
AssigneeVIA Technologies, Inc.
InventorChi-Hsing Hsu
Life of this patent
Estimating the term…
Abstract
A package includes a carrier, a first chip, a first dielectric layer and at least one first connecting part. The carrier has a first surface and a second surface, and at least one first pad is disposed on the second surface. The first chip is disposed on the first surface. The first dielectric layer is disposed on the first surface and covers the first chip. The first connecting part is disposed in the first dielectric layer and disposed around an edge of the first chip to electrically connect the first chip with the first pad. A package module of the package is also disclosed.
Claims20
A package, comprising:
- a carrier having a first surface and a second surface, wherein at least one first pad is disposed on the second surface;
- a first chip disposed on the first surface;
- a first dielectric layer disposed on the first surface and covering the first chip;
- and
- at least one first connecting part disposed in the first dielectric layer and adjacent to an edge of the first chip, wherein the first chip electrically connects with the first pad through the first connecting part, and wherein the first connecting part comprises a conductive via disposed by the edge of the first chip and passing through the first dielectric layer and a pad covering a portion of the first chip and a portion of the conductive via.
A package module comprising:
- a plurality of packages stacked, wherein one of the packages comprises
- a carrier having a first surface and a second surface, wherein at least one first pad is disposed on the second surface;
- a first chip disposed on the first surface;
- a first dielectric layer disposed on the first surface and covering the first chip;
- at least one first connecting part disposed in the first dielectric layer and adjacent to an edge of the first chip, wherein the first chip electrically connects with the first pad through the first connecting part;
- at least one second pad disposed on the first dielectric layer and electrically connects with the first connecting part;
- and
- a bump or a solder ball disposed on the second pad to electrically connect with the first pad of another chip or another package.
Dependencies are inferred from the claim text.