Semiconductor device, electronic device, and manufacturing method of the same

A semiconductor device including a bipolar transistor, the bipolar transistor comprising:

• a semiconductor substrate of a first conduction type;
• an embedded collector region of a second conduction type opposite the first conduction type formed over the semiconductor substrate;
• a collector region of the second conduction type formed over the embedded collector region;
• a base region of the first conduction type formed over the collector region;
• an emitter region of the second conduction type formed over the base region;
• a base extraction electrode formed over the base region and electrically connected to the base region;
• an emitter extraction electrode formed over the emitter region and electrically connected to the emitter region;
• a collector extraction region of the second conduction type formed over the embedded collector region and disposed so as to surround the collector region, the base region, and the emitter region in plan view, the collector extraction region being electrically connected to the embedded collector region and the collector region;
• a first inter layer insulating film formed over the base extraction electrode and the collector extraction region;
• a collector wiring, a base wiring, and an emitter wiring formed over the inter layer insulating film and electrically connected to the collector extraction region, the base extraction electrode, and the emitter extraction electrodes, respectively;
• and
• the semiconductor device further including:
• a first groove formed outside of the collector extraction region in plan view, the first groove extending through the first inter layer insulating film and the first groove reaching the semiconductor substrate;
• a first electrically conductive film embedded in the first groove and electrically connected to the semiconductor substrate;
• a second inter layer insulating film formed over the collector wiring, the base wiring, and the emitter wiring;
• a collector pad, a base pad, and an emitter pad formed over the second interlayer insulating film and electrically connected to the collector wiring, the base wiring, and the emitter wiring, respectively, the emitter pad being electrically connected to the first electrically conductive film;
• and
• a protection film formed over the collector pad, the base pad, and the emitter pad, the collector pad, the base pad, and the emitter pad being partially exposed from the protection film.