Electronic systems using optical waveguide interconnects formed through a semiconductor wafer
AssigneeMicron Technology, Inc.
InventorsJoseph E. Geusic, Kie Y. Ahn, Leonard Forbes
Life of this patent
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Abstract
An integrated circuit with a number of optical waveguides that are formed in high aspect ratio holes. The high aspect ratio holes extend through a semiconductor wafer. The optical waveguides include a highly reflective material that is deposited so as to line an inner surface of the high aspect ratio holes which may be filled with air or a material with an index of refraction that is greater than 1. These metal confined waveguides are used to transmit signals between functional circuits on the semiconductor wafer and functional circuits on the back of the wafer or beneath the wafer.
Claims45
A system, comprising:
- a first semiconductor including a first surface and a second surface opposite to the first surface;
- a first integrated circuit formed in the first surface of the first semiconductor;
- a second semiconductor including a third surface and a fourth surface opposite to the third surface;
- a second integrated circuit formed in the third surface of the second semiconductor, wherein the third surface abuts the second surface;
- and
- at least one optical waveguide formed in the first semiconductor to guide signals between the first integrated circuit and the second integrated circuit, wherein the waveguide includes an electrically conductive layer.
A system, comprising:
- a first semiconductor including a first surface and a second surface opposite to the first surface;
- a first integrated circuit formed in the first surface of the first semiconductor;
- a second semiconductor including a third surface and a fourth surface opposite to the third surface;
- a second integrated circuit formed in the third surface of the second semiconductor, wherein the third surface abuts the second surface;
- and
- means for guiding an optical signal from the first integrated circuit to the second integrated circuit as the signal is transmitted through the first semiconductor.
A system, comprising:
- a first semiconductor including a first surface and a second surface opposite to the first surface;
- a first integrated circuit formed in the first surface of the first semiconductor;
- a second semiconductor including a third surface and a fourth surface opposite to the third surface;
- a second integrated circuit formed in the third surface of the second semiconductor, wherein the third surface abuts the second surface;
- and
- means for reducing signal loss or dissipation between the first integrated circuit and the second integrated circuit as the signal is transmitted through the first semiconductor.
A system, comprising:
- a first semiconductor substrate having a first surface and an opposing second surface;
- a first integrated circuit integrally formed within the first surface of the first semiconductor substrate;
- a second semiconductor substrate having a third surface and an opposing fourth surface;
- a second integrated circuit integrally formed within the third surface of the second semiconductor substrate, wherein the third surface abuts the second surface;
- and
- at least one optical waveguide formed in an etched through hole that extends through the first semiconductor substrate that is operable to guide signals between the first integrated circuit and the second integrated circuit.
Dependencies are inferred from the claim text.