Light-emitting diode assembly
AssigneeFoxconn Technology Co., Ltd.
InventorsLi-Kuang Tan, Yeu-Lih Lin, Tseng-Hsiang Hu
Life of this patent
Estimating the term…
Abstract
A light emitting diode (LED) assembly includes at least an LED (102), a substrate (20), a heat dissipation apparatus (40) and at least one securing frame (30). The substrate forms a set of electrical circuitry (22) thereon. The at least one LED is arranged on a side of the substrate and electrically connected with the set of electrical circuitry of the substrate. The heat dissipation apparatus is arranged on an opposite side of the substrate. The securing frame includes a pressing portion (32) securing the substrate with the heat dissipation apparatus detachably.
Claims17
A light-emitting diode (LED) assembly, comprising:
- a substrate with a set of electrical circuitry being formed thereon;
- at least one LED being arranged on first side of the substrate and electrically connected with the set of electrical circuitry of the substrate;
- a heat dissipation apparatus being arranged on a second side of the substrate opposite to the first side of the substrate;
- and
- at least one securing frame having a pressing portion securing the substrate with the heat dissipation apparatus detachably;
- wherein the pressing portion comprises a first part abutting the heat dissipation apparatus and a second part abutting the substrate;
- and
- wherein the first part forms a first contact for being electrically connected with a power source, and the second part forms at least a second contact being electrically connected with the set of electrical circuitry of the substrate and being electrically connected with the first contact of the first part.
An LED assembly comprising:
- a substrate having a top surface and an opposite bottom surface;
- a plurality of LEDs arranged in a matrix and mounted on the top surface of the substrate;
- a heat sink thermally connecting with the bottom surface of the substrate so that heat generated by the LEDs is dissipated by the heat sink, wherein the substrate is shorter than the heat sink so two end portions of the heat sink are exposed;
- and
- a pair of securing frames being detachably mounted on the two end portions of the heat sink and removably securing the substrate to the heat sink;
- wherein a bottom surface of each of the securing frames is provided with a pressure sensitive adhesive which removably bonds each of the securing frames, the heat sink and the substrate together;
- and
- wherein the bottom surface of each of the securing frames is formed as having a step-like configuration so that a gap is defined in the bottom surface to receive an end of the substrate therein.
An LED assembly comprising:
- a substrate having a top surface and an opposite bottom surface;
- a plurality of LEDs arranged in a matrix and mounted on the top surface of the substrate;
- a heat sink thermally connecting with the bottom surface of the substrate so that heat generated by the LEDs is dissipated by the heat sink, wherein the substrate is shorter than the heat sink so two end portions of the heat sink are exposed;
- and
- a pair of securing frames being detachably mounted on the two end portions of the heat sink and removably securing the substrate to the heat sink;
- wherein a bottom surface of each of the securing frames is provided with a pressure sensitive adhesive which removably bonds each of the securing frames, the heat sink and the substrate together;
- and
- wherein each of the securing frames is provided with an operating portion for facilitating a pulling force to be exerted to each of the securing frames thereby removing the securing frames from the heat sink and the substrate.
Dependencies are inferred from the claim text.