Microwave plasma processing apparatus for semiconductor element production

A processing apparatus used to execute a specific type of processing on a workpiece inside a processing container, comprising:

• a stage on which the workpiece is placed;
• a stage support element that supports the stage, the stage support element having a first space formed inside the stage support element;
• a flange pipe disposed under the processing container and used to exhaust the processing container;
• a stage supporting unit that supports a lower portion of the stage support element, the stage supporting unit further comprising a second space formed inside the stage supporting unit, the second space opening toward an opening formed at a side wall of the flange pipe, and the second space communicating with the first space and atmosphere via the opening formed at the side wall of the flange pipe;
• a first fixing portion that non-rotatably fixes a side of the stage supporting unit to a first inner side surface of the flange pipe;
• a second fixing portion that non-rotatably fixes a bottom of the stage supporting unit to a second inner side surface of the flange pipe;
• wherein the second fixing portion includes a fixing member connected to the bottom of the stage supporting unit via a non-rotatable retaining member disposed at the bottom of the stage supporting unit, the fixing member being fixed to the second inner side surface of the flange pipe, the fixing member being removably attached to the retaining member,
• wherein the fixing member is configured to horizontally position the stage via the stage supporting unit by fixing the bottom of the stage supporting unit during an assembly of at least the stage and the stage supporting unit, and
• wherein the first fixing portion fixes the side of the stage supporting unit positioned by the fixing member during the assembly near the opening formed at the side wall of the flange pipe.