Semiconductor device assemblies with compliant spring contact structures

A semiconductor device assembly comprising:

• a carrier substrate having a plurality of compliant electrical contacts, at least one of the plurality of compliant electrical contacts in electrical communication with a circuitry on or within the carrier substrate, each of the plurality of compliant electrical contacts comprising:
• at least one conductive trace secured to the carrier substrate, the at least one conductive trace having a free, cantilevered portion, the at least one conductive trace having bonded thereto only on an upper surface thereof at least one stressed material filling an aperture within the at least one conductive trace and extending over at least part of the free, cantilevered portion and having a length less than a full length of the at least one conductive trace, the at least one stressed material exhibiting an at least partially tensile stress state sufficient to bias the free, cantilevered portion away from the carrier substrate;
• and
• at least one semiconductor die having an active surface including a plurality of bond pads thereon, at least one of the plurality of bond pads bonded to one of the plurality of compliant electrical contacts of the carrier substrate.

A semiconductor device assembly comprising:

• a semiconductor substrate having a plurality of compliant electrical contacts, at least one of the plurality of compliant electrical contacts in electrical communication with a circuitry on or within the semiconductor substrate, each of the plurality of compliant electrical contacts comprising:
• at least one conductive trace secured to the semiconductor substrate, the at least one conductive trace having a free, cantilevered portion, the at least one conductive trace having bonded thereto only on an upper surface thereof at least one stressed material filling an aperture within the at least one conductive trace and extending over at least part of the free, cantilevered portion and having a length less than a full length of the at least one conductive trace, the at least one stressed material exhibiting an at least partially tensile stress state sufficient to bias the free, cantilevered portion away from the semiconductor substrate;
• and
• a carrier substrate having a surface including a plurality of terminal pads thereon, at least one of the plurality of terminal pads bonded to one of the plurality of compliant electrical contacts of the semiconductor substrate.

A semiconductor device assembly comprising:

• a probe card comprising:
• a substrate having a plurality of compliant electrical contacts, each of the plurality of compliant electrical contacts comprising:
• at least one conductive trace secured to the substrate, the at least one conductive trace having a free, cantilevered portion, the at least one conductive trace having bonded thereto only on an upper surface thereof at least one stressed material filling an aperture within the at least one conductive trace and extending over at least part of the free, cantilevered portion and having a length less than a full length of the at least one conductive trace, the at least one stressed material exhibiting an at least partially tensile stress state sufficient to bias the free, cantilevered portion away from the substrate;
• and
• at least one semiconductor die having an active surface including a plurality of bond pads thereon, at least some of the plurality of compliant electrical contacts of the probe card in electrical communication with respective bond pads of the at least one semiconductor die.