High thermal conductivity dielectric tape
AssigneeSiemens Energy, Inc.
InventorMark L. Miller
Life of this patent
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Abstract
An electrical insulation tape that has a first and second carrier layer, and a dielectric thermally conductive, electrically insulative filler layer (24) that has mica particles/flakelets (6), filler particles (26) and a binder resin (28), disposed between the first and second carrier layers. The dielectric filler layer has mica flakelets (30), filler particles (32) and a binder resin. The ratio of mica flakelets to filler particles is at least 1:1 by volume, and the percentage of binder resin in the dielectric filler layer is 35-50% by volume. The first and second carrier layers are impregnated with a second resin.
Claims11
An electrical insulation tape comprising:
- a first and second carrier layers;
- and
- a dielectric filler layer disposed between said first and said second carrier layers;
- wherein said dielectric filler layer comprises mica flakelets, filler particles and a binder resin;
- wherein the ratio of said mica flakelets to said filler particles is at least 1:1 by volume;
- wherein the percentage of said binder resin in said dielectric filler layer is 25-50% by volume;
- wherein said first and said second carrier layers are impregnated with a second resin, wherein said second resin is a thermoset polymeric resin;
- wherein said filler particles comprise at least one of ZnO, BeO and SiC;
- and
- wherein said filler particles have a length of between 1-100,000 nm and an aspect ratio of approximately 5-50.
An electrical insulation tape comprising:
- a first and a second glass fabric layer;
- and
- a dielectric filler layer disposed between said first and said second glass fabric layers;
- wherein said dielectric filler layer comprises mica flakelets, thermally conductive filler particles and a binder resin;
- wherein the ratio of said mica flakelets to said filler particles is at least 1:1 by volume;
- wherein the percentage of said binder resin in said filler layer is 25-50% by volume;
- wherein said first and said second glass fabric layers are pre-impregnated with a second thermoset polymeric resin;
- wherein the thermally conductive filler particles further comprise particles of an inorganic material coated with a material exhibiting a higher thermal conductivity than that of the inorganic material.
Dependencies are inferred from the claim text.