Underfill process
AssigneeMicron Technology, Inc.
InventorTongbi Jiang
Life of this patent
Estimating the term…
Abstract
A method and apparatus for underfilling a gap between a semiconductor die or device and a substrate, where the semiconductor die or device is electrically connected to the substrate so that an active surface of the semiconductor die is facing a top surface of the substrate with the gap therebetween. A silane layer is applied to the active surface of the semiconductor die, the upper surface of the substrate, and/or both to increase the surface tension thereon. The increased surface tension thereby allows the underfill material to fill the gap via capillary action in a lesser flow time more effectively, and therefore, is more efficient than conventional underfilling methods.
Claims38
A method for applying a material between a semiconductor device having a surface and a substrate having a surface, said method comprising:
- applying a liquid wetting agent layer to one of said surface of said semiconductor device and said surface of said substrate;
- and
- applying a flowable underfill material between the substrate and the semiconductor device, such that said flowable material contacts said liquid wetting agent layer.
A method for applying a material between a semiconductor device and a substrate, said method comprising:
- providing a semiconductor device having an active surface, another surface, a first end, a second end, a first lateral side, and a second lateral side, said first end, said second end, said first lateral side, and said second lateral side forming at least a portion of a periphery of said semiconductor device;
- providing a substrate having an upper surface, a first side wall, a second side wall, a first lateral side wall and a second lateral side wall;
- applying a liquid wetting agent layer to one of said active surface of said semiconductor device and said upper surface of said substrate;
- and
- applying a flowable underfill material between said semiconductor device and said substrate, such that said flowable material contacts said applied liquid wetting agent layer.
A method for attaching a semiconductor assembly, said method comprising:
- providing a semiconductor device having an active surface;
- providing a substrate having an upper surface;
- applying a liquid wetting agent layer to one of said active surface of said semiconductor device and said upper surface of said substrate;
- connecting said semiconductor device to said substrate so that said active surface of said semiconductor device faces said upper surface of said substrate;
- and
- applying a flowable underfill material between the substrate and the semiconductor device, such that said flowable underfill material contacts said applied wetting agent layer.
A method for attaching a semiconductor assembly, said method comprising:
- providing a semiconductor device having an active surface, a first end, a second end, a first lateral side end and a second lateral side end;
- providing a substrate having an upper surface, a first side wall, a second side wall, a first lateral side wall and a second lateral side wall;
- applying a silane-based material layer to one of a portion of said active surface of said semiconductor device and a portion of said upper surface of said substrate;
- connecting said semiconductor device to said substrate so that said active surface of said semiconductor device faces said upper surface of said substrate;
- and
- applying a flowable underfill material between said semiconductor device and said substrate, such that said flowable underfill material contacts said applied silane-based material layer.
A method for applying a material between a semiconductor device having a surface and a substrate having a surface, said semiconductor device mounted on said substrate, said method comprising:
- applying a essentially uniform liquid silane-based wetting agent layer having a total thickness of about a monolayer to at least one of said surface of said semiconductor device and said surface of said substrate;
- and
- applying a flowable underfill material between the substrate and the semiconductor device separately from said liquid silane-based wetting agent layer, such that said flowable material contacts said wetting agent layer.
Dependencies are inferred from the claim text.