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US 7,547,576 B2Granted
Solder wall structure in flip-chip technologies
AssigneeInternational Business Machines Corporation
InventorsTimothy Harrison Daubenspeck, Jeffrey Peter Gambino, Christopher David Muzzy, Wolfgang Sauter
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Abstract
A structure and method for forming the same. The semiconductor structure includes a first semiconductor chip and N solder bumps in direct physical contact with the first semiconductor chip, wherein N is a positive integer. The semiconductor structure also includes a first solder wall on a perimeter of the first semiconductor chip such that the first solder wall forms a closed loop surrounding the N solder bumps.
Claims1
A semiconductor fabrication method, comprising:
- providing a first semiconductor chip;
- forming N solder bumps in direct physical contact with the first semiconductor chip, wherein N is a positive integer;
- and
- forming a first solder wall on a perimeter of the first semiconductor chip such that the first solder wall forms a closed loop surrounding the N solder bumps,
- wherein the first semiconductor chip comprises a crack stop on a perimeter of the first semiconductor chip, and
- wherein the first solder wall is overlapping the crack stop.
3 more elements
Dependencies are inferred from the claim text.