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AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsHo-Ming Tong, Kao-Ming Su, Chao-Fu Weng, Teck-Chong Lee, Chian-Chi Lin, Chia-Jung Tsai, Chih-Nan Wei, Song-Fu Yang
Estimating the term…
A die bonder and a die bonding method thereof are provided. The die bonder includes a wafer platform, an arranging platform, a conveyer, at least one first pick-up device and a second pick-up device. The wafer platform is for placing a wafer with several dies. The conveyer is for carrying and conveying a substrate. The first pick-up device is for picking up one of the dies and placing each die on the arranging platform. The second pick-up device is for picking up the dies on the arranging platform and placing the dies on the substrate at the same time.
A die bonding method of a die bonder, the die bonder comprising a wafer platform, an arranging platform, a conveyer, at least one first pick-up device and a second pick-up device, the method comprising:
Dependencies are inferred from the claim text.
From the US filing history. Foreign family members aren’t listed.
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Manufacture or treatment: of die-attach connectors
Apparatus for manufacture or treatment: apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
For supporting or gripping: using temporarily an auxiliary support
Manufacture or treatment: batch processes
About 11 months of term left · ends 4 Oct 2027 (estimated)
This application claims the benefit of Taiwan application Serial No. 095137205, filed Oct. 5, 2006, the subject matter of which is incorporated herein by reference.
1. Field of the Invention
The invention relates in general to a die bonder and a die bonding method thereof, and more particularly to a two-stage die bonder bonding several dies on a substrate and a die bonding method thereof.
FIG. 1 illustrates a die bonder according to a preferred embodiment of the present invention;
FIG. 2 is a flow chart of a die bonding method of the die bonder according to the preferred embodiment of the present invention; and
FIG. 3 illustrates the arrangement of package units of a substrate and dies on an arranging platform.
Please refer to FIG. 1, a die bonder 100 according to a preferred embodiment of the present invention is illustrated in FIG. 1. The die bonder 100 at least includes a wafer platform 120, an arranging platform130, a conveyer 150, a first pick-up device 111 and a second pick-up device 112. The wafer platform 120 is for placing a wafer 300. The wafer 300 includes several dies 310. The conveyer 150 is for conveying a substrate200. The first pick-up device 111 is for picking up one of the dies 310 and arranging each die 310 on the arranging platform 130. The second pick-up device 112 is for picking up all the dies 310 on the arranging platform 130 at the same time and placing the dies 310 on the substrate 200.
As shown in FIG. 1, except the wafer platform 120, the arranging platform 130, the conveyer 150, the first pick-up device 111 and the second pick-up device 112, the die bonder 100 further includes a control unit 170, a database 160, a dispenser 180 and a heating device 140. In order to describe the function of each component, a die bonding method according to the present embodiment is illustrated as follow.
Please refer to both FIG. 1 and FIG. 2. FIG. 2 is a flow chart of the die-bonding method of the die bonder 100 according to the preferred embodiment of the present invention. First, in a step (a), a wafer 300 is provided on the wafer platform 120. The wafer 300 is separated into several dies 310.