US 7,547,571 B2 · Packaging method of a light-sensing semiconductor device and packaging structure thereof

Abstract

The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly applied to between two neighboring spacer walls on the non-light-sensing regions. Thus, when the light transparent cover is installed, there is no more adhesive dropping onto the light-sensing regions of the light-sensing chips. Further, when the light transparent cover is pressed to join with the spacer walls, with the trenches formed at the tops of the spacer walls, the adhesive will not overflow from the joint seams into the light-sensing regions.

Drawings

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Drawings

Claims4

Dependent claims

A packaging method of a light-sensing semiconductor device, comprising the steps of:

providing a light-sensing wafer having multiple light-sensing chips, wherein each said light-sensing chip has a light-sensing region and a non-light-sensing region positioned along a perimeter of said each light-sensing chip;
forming a buffer layer of a predetermined thickness on said light-sensing wafer;
etching a plurality of trenches in said buffer layer substantially in alignment with said non-light-sensing regions of neighboring light-sensing chips, each trench having a bottom of predetermined dimensions positioned at a predetermined depth, said depth being smaller than said predetermined thickness of said buffer layer;
removing portions of said buffer layer above said light-sensing regions through the entire said predetermined thickness thereof, and removing respective portions of said buffer layer between said bottom of said each trench and said light-sensing wafer to form channels of cross-sectional dimensions smaller than said predetermined dimensions of said bottom of said each trench, thereby forming a plurality of pairs of spacer walls on a respective areas corresponding to non-light sensing regions of neighboring light-sensing chips, in each pair thereof, said spacer walls being separated by respective one of said channels, wherein said each pair of spacer walls has a common one of said plurality of trenches positioned at tops of said pair of spacer walls, and wherein said common trench defines a receiving cavity at the tops of said spacer walls in each said pair thereof;
applying an adhesive in said receiving cavity at the tops of said spacer walls;
and
affixing a light transparent cover to said tops of said spacer walls via said adhesive, wherein at least one of said light-sensing regions, said space walls and said light transparent cover form at least one airtight space, and wherein said adhesive is substantially localized within said receiving cavity and said channel between said spacer walls in each said pair thereof.

4 more elements

Dependencies are inferred from the claim text.

Description1,793 words

Summary791 words

#1. Field of the Invention

#The present invention relates to a packaging method of a semiconductor device and a packaging structure thereof, particularly to a packaging method of a light-sensing semiconductor device and a packaging structure thereof, which can protect a light-sensing chip from the pollution by external particles.

#2. Description of the Related Art

Brief description of the drawings4 figures

#FIG. 1A and FIG. 1B are section views schematically showing the steps of the conventional packaging method of a light-sensing semiconductor device.

#FIG. 2 is a section view schematically showing the packaging structure of a light-sensing semiconductor device according to the present invention.

#FIG. 3A to FIG. 3D are section views schematically showing the steps of the packaging method according to one embodiment of the present invention.

Detailed description911 words

#The present invention is a packaging method of a light-sensing semiconductor device and a packaging structure thereof, which provides a mechanism by which light can access the light-sensing chip inside the light-sensing semiconductor device and protects the light-sensing chip from the pollution by external particles.

#Refer to FIG. 2 a diagram schematically showing the packaging structure of a light-sensing semiconductor device according to the present invention. This wafer-scale packaging structure of a light-sensing semiconductor device according to the present invention comprises: a light-sensing wafer 30, having multiple light-sensing chips 32, with each light-sensing chip 32 having a light-sensing region 34 and a non-light-sensing region 36; spacer walls 38, separately encircling the non-light-sensing regions 36 of the light-sensing chips 32; and a light transparent cover 40, affixed to the spacer walls 38 with an adhesive 42, such as a thermosetting glue or a UV glue, and covering the light-sensing regions 34, wherein the light transparent cover 40, the spacer walls 38 and the light-sensing regions 34 together form multiple airtight spaces. In the present invention, one identical light transparent cover 40 may cover either multiple light-sensing chips 32, as shown in FIG. 2, or only one light-sensing chip 32.

#The abovementioned light transparent cover 40 may also be designed to filter out a light of a specific wavelength, such as a far-infrared ray.

Facts

Application

12/078,819Filed 7 Apr 2008 · division

Priority

30 Sep 2005

Published

US 2008/0188031 A17 Aug 2008

Granted

16 Jun 2009

Term ended

30 Sep 2025

Estimated · how

20 years from earliest known nonprovisional domestic filing plus recorded patent term adjustment. Maintenance-fee lapses, terminal disclaimers and statutory extensions have not been checked. The continuity chain may be incomplete; this is not an enforceability determination.

Classification3 codes

H10F 39/804
Constructional details of image sensors: containers or encapsulations
H10F 77/50
Constructional details of devices covered by this subclass: encapsulations or containers
H10F
Solar cells and light sensors

Packaging method of a light-sensing semiconductor device and packaging structure thereof

Life of this patent

Packaging method of a light-sensing semiconductor device and packaging structure thereof

Life of this patent

Life of this patent

Abstract

Drawings

Drawings

Claims4

Description1,793 words

Drawings

Classification3 codes

Life of this patent

Description1,793 words