Back to results
US 7,547,567 B2Granted
Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus
AssigneeSeiko Epson Corporation
InventorsKatsuyuki Moriya, Toshimitsu Hirai
Life of this patent
Estimating the term…
Abstract
A method of forming a film pattern by disposing functional liquid on a substrate includes: forming banks on the substrate; disposing the functional liquid in regions partitioned by the banks; and drying the functional liquid disposed on the substrate. The forming of the banks includes forming a thin film on the substrate, the thin film being made of a material for forming the banks, performing lyophobic treatment on a surface of the thin film, and patterning the thin film into the shapes of the banks.
Claims12
A method of forming a film pattern by disposing functional liquid on a substrate, comprising:
- forming a plurality of banks on the substrate, adjacent banks beings separated by a trench having a plurality of first portions including a first width that are each connected by a plurality of second portions having a second width, the second width being greater than the first width and a transition region between the first portions and the second portions being hexagonal in shape when viewed in plan;
- disposing the functional liquid in the trench partitioned by the banks;
- and
- drying the functional liquid disposed on the substrate,
- wherein the forming of the banks includes:
- forming a thin film on the substrate, the thin film being made of a material for forming the banks;
- after forming the thin film on the substrate, performing lyophobic treatment on a surface of the thin film;
- and
- after performing the lyophobic treatment on a surface of the thin film, patterning the thin film into the shapes of the banks.
6 more elements
Dependencies are inferred from the claim text.