Method of manufacturing device having flexible substrate and device having flexible substrate manufactured using the same

#The present invention relates to a method of manufacturing a device having a flexible substrate and a device having a flexible substrate manufactured using the same.

#This application claims priority benefits from Korean Patent Application No. 10-2005-0103899, filed on Nov. 1, 2005, the entire contents of which are fully incorporated herein by reference.

#In general, an organic light emitting device (OLED) includes two electrodes (an anode and a cathode) and at least one organic layer interposed between the two electrodes. In the organic light emitting device having this structure, when a voltage is applied between the two electrodes, holes from the anode and electrons from the cathode are injected into the organic layer. The electrons and the holes are recombined in the organic layer to thereby form excitons. When the excitons drop to a ground state again, photons corresponding to the energy difference are emitted. According to this principle, the organic light emitting device emits visible rays. Using this, it is possible to manufacture information display devices or illumination devices.

#FIG. 1 is a view showing molecular formulas of parylene N, C and D;

#FIG. 2 is a conceptual view showing a parylene deposition process;

#FIG. 3 is a view showing a process of manufacturing an organic light emitting device having a flexible substrate according to an embodiment of the present invention;

#Manufacturing organic light emitting device having flexible substrate according to first embodiment of the present invention

#A glass substrate is used for a mother substrate, and parylene C is used for a substrate for manufacturing an organic light emitting device and a sealant.

#The glass substrate, which is the mother substrate and has a size of 100×100 mm2, is initially cleaned using acetone and methanol. Then, the cleaned glass substrate is put into a parylene deposition apparatus. A first parylene layer is deposited to a thickness of 30 μm using a vapor deposition method in the parylene deposition apparatus. The parylene is deposited over the entire surface of the glass substrate, except for point contacts of three pins for supporting the glass substrate, which is the mother substrate. FIG. 2 is a conceptual view showing a parylene deposition process. After the first parylene layer is deposited over the mother substrate, an organic light emitting device is manufactured thereon by forming a positive electrode, an organic material having a multi-layered structure, and a negative electrode. Then, as a sealing process of protecting the organic light emitting device against external air, the manufactured device having a structure, in which the first parylene layer and the organic light emitting device are sequentially deposited on the mother substrate, is put into the parylene deposition apparatus. Further, a second parylene layer is deposited to a thickness of 30 μm using the vapor deposition method. In order to separate the organic light emitting device from the mother substrate, the two parylene layers are cut along an outer edge of the organic light emitting device, by using a knife or the like. Then, the device having a structure that includes the first parylene layer, the organic light emitting layer, and the second parylene layer is separated from the mother substrate, such that the device is manufactured.