Substrate polishing apparatus

A substrate polishing apparatus comprising:

• a polishing table for having a substrate pressed there against;
• a light-emitting and light-receiving device to emit measurement light from said polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate;
• a fluid supply passage for supplying a measurement fluid to a fluid chamber provided at a light-emitting and light-receiving position of said polishing table, wherein the measurement light and the reflected light are to pass through the measurement fluid;
• and
• a fluid supply light control device comprising means for controlling supply of the measurement fluid to said fluid chamber by causing the measurement fluid to be ejected to said fluid chamber during a blocking period during which said fluid chamber is blocked by the substrate.

A substrate polishing apparatus comprising:

• a polishing table for having a substrate pressed there against;
• a light-emitting and light-receiving device to emit measurement light from said polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate;
• a fluid supply passage for supplying a measurement fluid to a fluid chamber provided at a light-emitting and light-receiving position of said polishing table, wherein the measurement light and the reflected light are to pass through the measurement fluid;
• a fluid supply control device comprising means for controlling supply of the measurement fluid to said fluid chamber;
• and
• a compulsory discharge control means for controlling compulsory discharge of fluid from said fluid chamber according to a positional relationship between said fluid chamber and the substrate.

A substrate polishing apparatus comprising:

• a polishing table for having a substrate pressed there against;
• a light-emitting and light-receiving device to emit light from said polishing table to the substrate and to receive reflected light from the substrate;
• a first passage for ejection, said first passage for introducing a fluid, through which the light and the reflected light is to pass, into a fluid chamber provided at a light-emitting and light-receiving position of said polishing table;
• a second passage for a low flow rate into said fluid chamber, said second passage being restricted as compared to said first passage;
• and
• a switching means for switching flow of the fluid through one of said first and second passages to flow of the fluid through the other of said first and second passages.

A substrate polishing apparatus comprising:

• a polishing table having a polishing surface for polishing a semiconductor substrate;
• a light-emitting optical fiber for emitting measurement light, for measuring a film of the semiconductor substrate, through an opening provided in said polishing surface to the semiconductor substrate;
• and
• a light-receiving optical fiber for receiving the measurement light that is reflected from the semiconductor substrate,
• wherein an emitting end of said light-emitting optical fiber and an incident end of said light-receiving optical fiber are located adjacent each other, and a distance from said light-emitting optical fiber and said light-receiving optical fiber to the semiconductor substrate is based on an angle of divergence of said light-emitting optical fiber and an angle of divergence of said light-receiving optical fiber.

A substrate polishing apparatus comprising:

• a polishing table having a polishing surface for polishing a semiconductor substrate;
• a light-emitting optical fiber for emitting measurement light, for measuring a film of the semiconductor substrate, through an opening provided in said polishing surface to the semiconductor substrate;
• and
• a light-receiving optical fiber for receiving the measurement light that is reflected from the semiconductor substrate,
• wherein an emitting end of said light-emitting optical fiber and an incident end of said light-receiving optical fiber are located adjacent each other, and a distance from said light-emitting optical fiber and said light-receiving optical fiber to the semiconductor substrate is based on an angle of divergence of said light-emitting optical fiber and an angle of divergence of said light-receiving optical fiber;
• and
• wherein the distance from said light-emitting optical fiber and said light-receiving optical fiber to the semiconductor substrate is based on a value L calculated from
• L=(1−N2)1/2×(2T+C)/2N,
• where N is a numerical aperture of said light-emitting optical fiber and said light-receiving optical fiber, C is a core diameter of said light-emitting optical fiber and said light-receiving optical fiber, and T is a thickness of a clad of said light-emitting optical fiber and said light-receiving optical fiber.

A substrate polishing apparatus comprising:

• a polishing table having a polishing surface for polishing a semiconductor substrate;
• a light-emitting optical fiber for emitting measurement light, for measuring a film of the semiconductor substrate, through an opening in said polishing surface to the semiconductor substrate;
• and
• a light-receiving optical fiber for receiving the measurement light that is reflected from the semiconductor substrate,
• wherein an optical axis of said light-emitting optical fiber and an optical axis of said light-receiving optical fiber are inclined with respect to each other.

A substrate polishing apparatus comprising:

• a polishing table having a polishing surface for polishing a semiconductor substrate;
• and
• an optical fiber member for emitting measurement light, for measuring a film of the semiconductor substrate, through an opening in said polishing surface to the semiconductor substrate, and for receiving the measurement light that is reflected from the semiconductor substrate,
• wherein said optical fiber member includes at least one light-emitting optical fiber and at least one light-receiving optical fiber, with one of said at least one light-emitting optical fiber and said at least one light-receiving optical fiber being surrounded by the other of said at least one light-emitting optical fiber and said at least one light-receiving optical fiber.

A substrate polishing apparatus comprising:

• a polishing table having a polishing surface for polishing a semiconductor substrate;
• and
• an optical fiber member for emitting measurement light, for measuring a film of the semiconductor substrate, through an opening in said polishing surface to the semiconductor substrate, and for receiving the measurement light that is reflected from the semiconductor substrate,
• wherein said optical fiber member includes light-emitting optical fibers and light-receiving optical fibers, with said light-emitting optical fibers and said light-receiving optical fibers being bundled together.

A substrate polishing apparatus comprising:

• a polishing table having a polishing surface for polishing a semiconductor substrate;
• and
• an optical fiber member for emitting measurement light, for measuring a film of the semiconductor substrate, through an opening in said polishing surface to the semiconductor substrate, and for receiving the measurement light that is reflected from the semiconductor substrate,
• wherein said optical fiber member comprises a composite optical fiber having divided cross-sections including a region of a light-emitting optical fiber and a region of a light-receiving optical fiber.