Large array connector for coupling wafers with a printed circuit board

An electronic assembly comprising:

• a printed circuit board comprising a plurality of mounting locations;
• and
• a large array connector for coupling a plurality of wafers with the printed circuit board, the large array connector being mechanically coupled to the printed circuit board, and wherein the large array connector comprises:
• a plate comprising a front portion, a rear portion, a top portion, a bottom portion, a first side portion, and a second side portion;
• a plurality of guide blocks including first and second guide blocks for providing rigid support to at least the plate, the first guide block being mechanically coupled to a first end of the front portion of the plate, and the second guide block being mechanically coupled to a second end of the front portion of the plate;
• and
• a plurality of wafers located between the first guide block and the second guide block, a front portion of each of the wafers being mateable with a mid-plane,
• wherein a fill material is provided between a first portion of each of the wafers and the front portion of the plate,
• the fill material is substantially continuous between each wafer, and
• the fill material substantially mechanically couples the first portion of each of the wafers and the front portion of the plate, and provides rigid support to each of the wafers during plug-in with the mid-plane.

A large array connector for coupling a plurality of wafers with a printed circuit board, the large array connector comprising:

• a plate comprising a front portion, a rear portion, a top portion, a bottom portion, a first side portion, and a second side portion;
• a plurality of guide blocks including a first guide block mechanically coupled to a first end of the front portion of the plate, a second guide block mechanically coupled at a second end of front portion of the plate, a third guide block, and a fourth guide block, wherein the third and fourth guide blocks are mechanically coupled to the front portion of the plate at locations equidistant from the first end and second end, respectively, and
• a plurality of wafers located between the first and third guide blocks, the third and fourth guide blocks, and the fourth and second guide blocks, a front portion of each of the wafers being mateable with a mid-plane,
• wherein a fill material is provided between a first portion of each of the wafers and the front portion of the plate, the fill material substantially mechanically coupling the first portion of each of the wafers and the front portion of the plate, and providing rigid support to each of the wafers during plug-in with the mid-plane.