Edge-to-edge connector system for electronic devices

A connector system for use with electronic devices, comprising:

• (a) at least two component substrates, wherein each of the at least two component substrates further comprises at least one electrically conductive contact surface;
• and
• (b) at least one connector apparatus for connecting the at least two substrates to one another at the edges thereof, wherein the at least one connector apparatus enables electrical communication between the at least two substrates and further includes:
• (i) at least one electrically conductive transverse conducting member, wherein a first portion of the transverse conducting member contacts the contact surface on the first substrate, and wherein a second portion of the transverse conducting member contacts the contact surface on the second substrate;
• and
• (ii) means for securing the at least one transverse conducting member to each of the substrates and to each of the contact surfaces, wherein the means for securing the at least one transverse conducting member to each of the substrates and to each of the contact surfaces further comprises hook-like structures formed on either side of the transverse conducting member and apertures formed in each of the substrates that correspond to the hook-like structures formed on the transverse conducting member.

A connector for use with at least two electronic component substrates, wherein each of the at least two substrates further includes at least one electrically conductive contact surface, the connector comprising:

• (a) a connector apparatus for connecting the at least two substrates to one another at the edges thereof and enabling electrical communication therebetween, wherein the connector apparatus further includes:
• (i) at least one electrically conductive transverse conducting member, wherein a first portion of the at least one transverse conducting member contacts the contact surface on the first substrate, and wherein a second portion of the transverse conducting member contacts the contact surface on the second substrate;
• and
• (ii) a substantially non-conductive housing component, wherein the housing component further includes means for securing the at least one transverse conducting member therein;
• and
• (iii) mechanical means for securing the at least one transverse conducting member to each of the substrates and to each of the contact surfaces, wherein the means for securing the at least one transverse conducting member within the housing includes a protrusion formed within a central portion of the housing component, wherein the protrusion cooperates with an aperture formed in a central portion of the transverse conducting member.

A connector for use with at least two electronic component substrates, wherein each of the at least two substrates further includes at least one electrically conductive contact surface, the connector comprising:

• (a) a connector apparatus for connecting the at least two substrates to one another at the edges thereof and enabling electrical communication therebetween, wherein the connector apparatus further includes:
• (i) at least one electrically conductive transverse conducting member, wherein a first portion of the at least one transverse conducting member contacts the contact surface on the first substrate, and wherein a second portion of the transverse conducting member contacts the contact surface on the second substrate;
• and
• (ii) mechanical means for securing the at least one transverse conducting member to each of the substrates and to each of the contact surfaces, wherein the mechanical means for securing the at least one transverse conducting member to each of the substrates and to each of the contact surfaces further comprises hook-like structures formed on either side of the transverse conducting member and corresponding apertures formed in each of the substrates.

A method for connecting substrates for use with electronic devices to one another, comprising:

• (a) providing at least two electronic component substrates, wherein each of the at least two substrates further comprises an electrically conductive contact surface;
• (b) providing at least one connector apparatus for connecting the at least two substrates to one another at the edges thereof wherein the at least one connector apparatus enables electrical communication between the at least two substrates and further includes:
• (i) at least one electrically conductive transverse conducting member, wherein a first portion of the at least one transverse conducting member contacts the contact surface on the first printed circuit board, and wherein a second portion of the transverse conducting member contacts the contact surface on the second printed circuit board;
• and
• (ii) mechanical means for securing the at least one transverse conducting member to each of the substrates and to each of the contact surfaces, wherein the mechanical means for securing the at least one transverse conducting member to each of the substrates and to each of the contact surfaces further comprises hook-like structures formed on either side of the transverse conducting member and corresponding apertures formed in each of the substrates;
• and
• (c) electrically connecting the at least two substrates to one another by contacting the at least one transverse conducting member with the contact surfaces on each substrate;
• and
• (d) physically connecting the at least two substrates to one another by engaging the mechanical means for securing the at least one transverse conducting member to each of the substrates and to each of the contact surfaces.