Memory modules and methods for manufacturing memory modules

A memory module for use in a connector having a socket and a plurality of pins, the memory module comprising:

• a body including a first surface, a second surface opposite the first surface, a first longitudinal side between the first and second surfaces, and a second longitudinal side between the first and second surfaces and opposite the first longitudinal side, wherein the second longitudinal side is generally continuous and nonplanar;
• a memory device mounted to the body;
• and
• a plurality of external contact pads operably coupled to the memory device, the external contact pads being arranged on the first surface proximate to the second longitudinal side for electrical connection with corresponding pins when the module is received in the socket.

A memory module for use in a connector having a socket and a plurality of pins, the memory module comprising:

• a substrate including a first surface, a second surface opposite the first surface, a first longitudinal side between the first and second surfaces, and a second longitudinal side between the first and second surfaces and opposite the first longitudinal side, the first longitudinal side defining a first plane and the second longitudinal side defining a second plane nonparallel with the first plane;
• a microelectronic device carried by the substrate;
• a first plurality of external contact pads positioned on the first surface;
• and
• a second plurality of external contact pads positioned on the second surface, the first and second external contact pads electrically coupling the microelectronic device to an external device when the module is received in the socket and the first and second pluralities of external contact pads contact corresponding pins.

A memory module for use with a connector having a socket, the memory module comprising:

• a substrate including a surface;
• a microelectronic device carried by the substrate;
• and
• a plurality of external contact pads operably coupled to the microelectronic device, the external contact pads being arranged on the surface such that at least several of the contact pads engage corresponding pins of the socket at different times as the module is inserted generally perpendicularly into the socket to reduce the insertion force.

A memory module for use with a connector having a socket, the memory module comprising:

• a substrate including a first surface and a second surface opposite the first surface;
• a microelectronic device carried by the substrate;
• a first plurality of external contact pads arranged on the first surface, the first plurality of external contact pads including a first pad with a first length and a second pad with a second length different than the first length;
• and
• a second plurality of external contact pads positioned on the second surface, the first and second pluralities of external contact pads being electrically coupled to the microelectronic device and positioned to contact corresponding pins when the module is received in the socket.

A memory module for use with a connector having a socket and a plurality of pins, the memory module comprising:

• a substrate including a first surface, a second surface opposite the first surface, a first longitudinal side between the first and second surfaces, a second longitudinal side opposite the first longitudinal side and between the first and second surfaces, a first longitudinal edge at the interface of the first surface and the second longitudinal side, and a second longitudinal edge at the interface of the second surface and the second longitudinal side;
• a microelectronic device carried by the substrate;
• a plurality of first external contact pads arranged on the first surface;
• and
• a plurality of second external contact pads arranged on the second surface, the individual first contact pads having a corresponding second contact pad that contacts an adjacent pin when the module is received in the socket, wherein one of the first contact pads is spaced apart from the first longitudinal edge by a first distance and the corresponding pad in the second contact pads is spaced apart from the second longitudinal edge by a second distance different than the first distance.