Pagewidth printhead thermal assembly for supporting printhead modules

A pagewidth printhead thermal assembly comprising an elongate support beam operatively supporting a plurality of printhead modules having at least one printhead integrated circuit, said support beam comprised of an odd number of layers of at least two different materials, said layers laminated together so that the support beam has a coefficient of thermal expansion similar to that of silicon, wherein

• the support beam includes a central layer with two outer layers, and the outer layers have a coefficient of thermal expansion of approximately 1.3×10−6 meters per degree Celsius.