Substrate gripping apparatus, substrate gripping method and substrate releasing method

A substrate gripping apparatus for gripping a substrate from above the substrate, the substrate being supported on a substrate support member below the substrate, said substrate gripping apparatus comprising:

• a plurality of hand bodies, each having a predetermined reference axis and formed in the shape of a flat plate perpendicular to the reference axis;
• hand body driving means for driving the hand bodies for displacement;
• a plurality of holding members including at least one movable one, arranged on a lower side of each of the hand bodies around the reference axis at angular intervals and capable of coming into contact with peripheral parts of the substrate to hold the substrate and of being separated from the peripheral parts of the substrate to release the substrate;
• a movable holding member driving means for driving the movable holding member of each of the hand bodies for an approaching movement toward the reference axis and a parting movement away from the reference axis;
• and
• a control means for controlling the hand body driving means and the movable holding member driving means;
• wherein in a state where the hand body is disposed so as to face the upper surface of the substrate supported on the substrate support member, and the reference axis of the hand body being aligned with the central axis of the substrate, each of the holding members having a first guide part including a first guide surface inclining downwardly toward the reference axis, and a second guide part including a second guide surface facing an upper surface of the substrate and including upwardly toward the reference axis, so that the first and second guide surfaces define a substantially V-shaped groove for receiving the peripheral part of the substrate, and
• the first guide surface having a length that is greater than a distance the movable holding member is capable of moving relative to the reference axis, and the first guide part being provided with a protrusion located at a lower end of the first guide part, the protrusion protruding from the first guide surface toward the reference axis.

A substrate gripping method using a substrate gripping apparatus, for gripping a substrate from above the substrate, the substrate being supported on a substrate support member below the substrate, including a hand body having a predetermined reference axis and formed in the shape of a flat plate perpendicular to the reference axis, a hand body driving means for driving the hand body for displacement, a plurality of holding members including at least one movable one, arranged on the lower side of the hand body around the reference axis at angular intervals and capable of coming into contact with peripheral parts of the substrate to hold the substrate and of being separated from the peripheral parts of the substrate to release the substrate, a movable holding member driving means for driving the movable holding member for an approaching movement toward the reference axis and a parting movement away from the reference axis, and a control means for controlling the hand body driving means and the movable holding member driving means, wherein in a state where the hand body is disposed so as to face an upper surface of the substrate supported on the substrate support member, and the reference axis of the hand body being aligned with a central axis of the substrate, each of the holding members having a first guide part including a first guide surface inclining downwardly toward the reference axis, and a second guide part including a second guide surface facing the upper surface of the substrate and inclining upwardly toward the reference axis, so that the first and second guide surfaces define a substantially V-shaped groove for receiving a peripheral part of the substrate, and the first guide surface having a length that is greater than a distance the movable holding member is capable of moving relative to the reference axis, and the first guide part being provided with a protrusion located at a lower end of the first guide part, the protrusion protruding from the first guide part and protruding from the first guide surface toward the reference axis, said substrate gripping method comprising the steps of:

• moving the hand body toward a substrate from one side of the substrate opposite the other side of the substrate on which the substrate support member is disposed;
• bringing a fixed holding member into contact with the peripheral part of the substrate;
• moving the movable holding member toward the reference axis by the movable holding member driving means to bring the movable holding member into contact with the peripheral part of the substrate;
• and
• moving the hand body away from the substrate support member.

A substrate releasing method using a substrate gripping apparatus, for gripping a substrate from above the substrate, the substrate being supported on a substrate support member from below the substrate, including a hand body having a predetermined reference axis and formed in the shape of a flat plate perpendicular to the reference axis, a hand body driving means for driving the hand body for displacement, a plurality of holding members including at least one movable one, arranged on the lower side of the hand body around the reference axis at angular intervals and capable of coming into contact with peripheral parts of the substrate to hold the substrate and of being separated from the peripheral parts of the substrate to release the substrate, a movable holding member driving means for driving the movable holding member for an approaching movement toward the reference axis and a parting movement away from the reference axis, and a control means for controlling the hand body driving means and the movable holding member driving means, wherein in a state where the hand body is disposed so as to face an upper surface of the substrate supported on the substrate support member, and the reference axis of the hand body being aligned with a central axis of the substrate, each of the holding members having a first guide part including a first guide surface inclining downwardly toward the reference axis, and a second guide part including a second guide surface facing the upper surface of the substrate and inclining upwardly toward the reference axis, so that the first and second guide surfaces define a substantially V-shaped groove for receiving a peripheral part of the substrate, and the first guide surface having a length that is greater than a distance the movable holding member is capable of moving relative to the reference axis, and the first guide part being provided with a protrusion located at a lower end of the first guide part protruding from the first guide part, the protrusion protruding from the first guide surface toward the reference axis, said substrate releasing method comprising the steps of:

• moving the hand body gripping a substrate toward the substrate support member and placing the substrate on the substrate support member;
• moving the movable holding member away from the reference axis by the movable holding member driving means to separate the movable holding member from the peripheral part of the substrate;
• and
• moving the hand body away from the substrate support member.