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US 7,546,757 B2Granted
Method of working small recess portion
AssigneeSeiko Epson Corporation
InventorsHideyuki Ogawa, Koichi Saito, Nagamitsu Takashima, Katsunori Ono
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Abstract
The invention is directed to a method of working a small recess portion. In the method, prior to press-forming small recess portions arrayed in a row by pressing a predetermined number of pieces of aligned male dies to a metal base plate, the metal base plate is previously formed with a highly rigid portion at a predetermined portion at a vicinity of an imaginary line extending in a row direction along end portions of predicted press portions to which the respective male dies are pressed.
Claims4
A metal plate working method comprising the steps of:
- pressing a first die onto a metal plate for press-forming a recess groove portion extending along and being spaced apart from an imaginary line, the recess groove portion defining a first portion and a second portion that is adjacent to the first portion along the imaginary line and that is higher in rigidity than the first portion;
- pressing a second die onto the metal plate for press-forming recess portion ends of which are aligned on the imaginary line, the second die having a predetermined number of male die pieces so that:
- the male die pieces are arranged in a row along the imaginary line;
- ends of some male die pieces are located on the imaginary line, and face the first portion;
- and
- ends of some other male die pieces are located on the imaginary line, and face the second portion,
- wherein the recess groove portion has a bottom partially formed with a through hole, the first portion corresponds to a first part of the recess groove portion which has the bottom formed with the through hole, and the second portion corresponds to a second part of the recess groove portion.
4 more elements
Dependencies are inferred from the claim text.