Methods for repairing circuit board having defective pre-soldering bump
AssigneePhoenix Precision Technology Corporation
InventorsShih-Ping Hsu, Chao Wen Shih
Life of this patent
Estimating the term…
Abstract
A method for repairing a circuit board having defective pre-soldering bumps is proposed. Firstly, the circuit board having a plurality of pre-soldering bumps on a surface thereof is provided, wherein at least one of the pre-soldering bumps has a defect. Then, a micro-electroplating process or a micro-electrolyzing process is performed by a micro-electrode nearby the defective pre-soldering bump, so as to repair the defective pre-soldering bump. Therefore, the present invention is able to enhance the process yield and reduce the production cost.
Claims9
A method for repairing a circuit board having defective pre-soldering bumps, comprising the steps of:
- providing the circuit board having a plurality of conductive pads and a solder mask formed on a surface thereof, wherein the solder mask has a plurality of openings to expose the conductive pads, the conductive pads have a plurality of pre-soldering bumps formed thereon, and wherein the pre-soldering bumps are made of a pre-soldering bump material and at least one of the pre-soldering bumps has a defect, and the circuit board further has an exposed wire electrically connecting to the conductive pad having the defective pre-soldering bump formed thereon;
- providing a direct current power supply having a first electrode and an opposing second electrode, wherein the first electrode is electrically contacted the exposed wire;
- providing an electrolyte having an anion of the pre-soldering bump material, and placing the circuit board into the electrolyte;
- and
- providing a micro-electrode nearby the defective pre-soldering bump to thereby repair the defect, wherein the micro-electrode electrically connects to the second electrode.
A method for repairing a circuit board having defective pre-soldering bumps, comprising the steps of:
- providing the circuit board having a plurality of conductive pads and a solder mask formed on a surface thereof, wherein the solder mask has a plurality of openings to expose the conductive pads, the conductive pads have a plurality of pre-soldering bumps formed thereon, and wherein the pre-soldering bumps are made of a pre-soldering bump material and at least one of the pre-soldering bumps has a defect, and the circuit board further has a conductive layer electrically connecting to the conductive pad having the defective pre-soldering bump formed thereon;
- providing a direct current power supply having a first electrode and an opposing second electrode, wherein the first electrode is electrically contacted the conductive layer;
- providing an electrolyte having an anion of the pre-soldering bump material, and placing the circuit board into the electrolyte;
- and
- providing a micro-electrode nearby the defective pre-soldering bump to thereby repair the defect, wherein the micro-electrode electrically connects to the second electrode.
Dependencies are inferred from the claim text.