Organic electronic devices having external barrier layer

An organic device package comprising:

• a flexible substrate having a topside and a bottom side;
• an organic electronic device having a first side and a second side disposed on the topside of the flexible substrate;
• a first barrier layer having a first inner surface and a first outer surface disposed on the bottom side of the flexible substrate, wherein the first barrier layer is substantially planar;
• a second barrier layer having a second inner surface and a second outer surface disposed proximate to the first side of the organic electronic device, wherein the second barrier layer is substantially planar;
• and
• an edge encapsulating material disposed about the perimeter of the organic electronic device between the first and second barrier layers, wherein the edge encapsulating material is coupled directly to each of the first inner surface of the first barrier layer and the second inner surface of the second barrier layer and configured to hermetically seal peripheral edges of the organic device package.