Heat-dissipating silicone grease composition
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsKunihiro Yamada, Hiroaki Tetsuka
Life of this patent
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Abstract
A heat dissipating silicone grease composition comprising: (A) 3% to 30% by weight of an organo polysiloxane represented by the general formula, R1aSiO(4−a)/2(R1 is one or two or more groups selected from a group of saturated or unsaturated monovalent hydrocarbon groups containing one to eighteen carbon atoms, and a is a positive number defined by 1.8≦a≦2.2) having a dynamic viscosity at 25° C. of 50 mm2/s to 500,000 mm2/s; (B) 60% to 96.9% by weight of a thermally conductive filler having a thermal conductivity of at least 10 W/(m·K); and (C) 0.1% to 10% by weight of a solvent that disperses or dissolves component (A).
Claims15
A heat dissipating silicone grease composition comprising:
- (A) 3% to 30% by weight of an organopolysiloxane of the formula:
- R1aSiO(4−a)/2
- where R1 is selected from saturated or unsaturated monovalent hydrocarbon groups containing one to eighteen carbon atoms, and a is a positive number defined by 1.8≦a≦2.2,
- and where the organopolysiloxane has a dynamic viscosity at 25° C. of 50 mm2/s to 500,000 Mm2/s;
- (B) 60% to 96.9% by weight of a thermally conductive filler having a thermal conductivity of at least 10 W/(m·K);
- and
- (C) 0.1% to 10% by weight of an isoparaffin type solvent having a boiling point of 80° C. to 260° C. that disperses or dissolves said organopolysiloxane (A) and which is capable of being evaporated from the composition to provide the grease,
- wherein the composition is capable of being applied by a printing process.
Dependencies are inferred from the claim text.