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US 7,520,054 B2Granted
Process of manufacturing high frequency device packages
AssigneeBridgewave Communications, Inc.
InventorsEliezer Pasternak, Sean Cahill, Bance Hom
Life of this patent
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Abstract
A high frequency device packaging method is described wherein an insulating material, attached to a fiat surface, is selectively etched and the etched insulating material is plated with a conductive material to form a center conductor for a coaxial via structure.
Claims6
A method of fabricating a conductive base structure with coaxial vias, comprising:
- selectively patterning an insulating material attached to a foundation layer to form an etched insulating material;
- plating said etched insulating material with a conductive material to form the conductive base structure that includes a center conductor and a conductive shield surrounding the etched insulating material;
- and
- separating the foundation layer from the etched insulating material, the center conductor, and the conductive shield, to form a coaxial via structure through the conductive base structure.
1 more element
Dependencies are inferred from the claim text.