Integrateable capacitors and microcoils and methods of making thereof

A method for integrally forming a capacitor and a microcoil on a substrate, the method comprising:

• forming and patterning a first dielectric layer on the substrate,
• depositing and patterning a first conductive material on the substrate;
• depositing and patterning a second dielectric material on the substrate;
• depositing a second conductive material on the substrate forming at least a first portion and a second portion;
• planarizing an exposed surface of the second conductive material and the patterned second dielectric material;
• depositing and patterning a sacrificial layer on the planarized surface;
• removing the patterned second dielectric material;
• forming third conductive material on the sacrificial layer;
• depositing and patterning a polymer layer on the substrate;
• removing a portion of the first conductive material exposed by the patterned polymer layer to release a portion of the first conductive material from the substrate to form out-of-plane windings of the microcoil;
• depositing fourth conductive material on exposed portions of the first conductive material and the third conductive material;
• removing the sacrificial layer;
• forming each of the first conductive material, the second conductive material and the fourth conductive material to include a first portion and a second portion corresponding to a first winding portion and a second winding portion of the same microcoil;
• and
• forming a capacitance region in the third conductive material between the first winding portion and the second winding portion.

A method for integrally forming a capacitance region and a microcoil on a substrate, the method comprising:

• forming a first electrode and a fixed portion of a second electrode associated with the capacitance region on the substrate;
• depositing and patterning a sacrificial layer on the first electrode;
• depositing and patterning a conductive material on the substrate, the patterning forming a pattern corresponding to windings of the microcoil and a pattern corresponding to a moveable portion of the second electrode, the moveable portion of the second electrode connecting to the fixed portion of the second electrode;
• depositing and patterning a polymer mask layer on the substrate;
• removing a portion of the deposited and patterned conductive material exposed by the mask layer to release at least a portion of the windings pattern from the substrate to form out-of-plane windings of the microcoil;
• depositing a second conductive material on the formed out-of-plane windings of the microcoil and the moveable portion of the second electrode;
• reflowing the polymer layer after removing the exposed portion of the deposited and patterned second conductive material to allow further out-of-plane movement of the windings;
• and
• removing the sacrificial layer forming a gap between the first electrode and the second electrode of the capacitor.