Adhesive aid composition
AssigneeNippon Kayaku Kabushiki Kaisha
InventorsMakoto Uchida, Toyofumi Asano
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Abstract
The present invention provides an adhesive aid composition having excellent adhesive strength to polyimide films without decreasing mechanical properties and being useful in the field of electric materials. An adhesive aid composition of the present invention contains a phenolic hydroxyl group-containing polyamide and a solvent as essential components. The phenolic hydroxyl group-containing polyamide preferably has a segment represented by formula (1): (wherein R1 represents a divalent aromatic group, and n represents an average number of substituents and is a positive number of 1 to 4). The adhesive aid composition of the present invention is suitably used for bonding polyimide films.
Claims9
A process for producing a surface-adhesive film comprising applying a polyimide precursor solution to a substrate, drying the polyimide precursor solution to prepare a polyimide precursor film, applying an adhesive aid composition containing a phenolic hydroxyl group-containing polyamide and a solvent to the polyimide precursor film, drying the adhesive aid composition, and then imidizing the polyimide precursor by heating at 200° C. to 500° C.
Dependencies are inferred from the claim text.