Device package and methods for the fabrication and testing thereof

A sealed device package, comprising:

• substrate;
• a lid comprising a semiconductor material over the substrate;
• a sealed volume between the substrate and the lid;
• and
• a device in the sealed volume;
• wherein the sealed volume is at a pressure such that a wall of the lid has a measurable deflection, and wherein the extent of deflection is dependent on the sealed volume pressure,
• wherein the deflection is an outward deflection of the wall.

A method of bonding a first component to a second component, comprising:

• (a) providing a plurality of layers between the first and second components, the plurality of layers comprising a first constituent layer, a second constituent layer of a different composition from the first constituent layer, and a diffusion barrier layer, wherein the diffusion barrier layer is disposed between the first and second constituent layers and the second constituent layer is disposed between the first component and the diffusion barrier layer;
• (b) applying a pressure to the first component to form a bond between the first component and the second constituent layer;
• and
• (c) heating the bonded structure to a temperature and for a time effective to cause inter-diffusion of atoms between the first and second constituent layers, wherein the resulting structure has an overall melting point greater than the heating temperature.