Semiconductor component having plate, stacked dice and conductive vias

A semiconductor component comprising:

• a base die comprising a plurality of first contacts and a plurality of first conductive vias in electrical communication with the first contacts;
• a plate attached to the base die comprising a plurality of second contacts bonded to the to the first conductive vias on the base die and a plurality of conductors in electrical communication with the second contacts configured to electrically connect selected first contacts to one another;
• a secondary die stacked on the base die comprising a plurality of third contacts in electrical communication with the first conductive vias and a plurality of second conductive vias in electrical communication with the third contacts;
• and
• a plurality of terminal contacts on the secondary die in electrical communication with the second conductive vias.

A semiconductor component comprising:

• a base die comprising a plurality of first conductive vias and a plurality of first contacts in electrical communication with the first conductive vias;
• a plate comprising a plurality of bumped contacts bonded to the first conductive vias and a plurality of conductors in electrical communication with the bumped contacts;
• and
• a secondary die stacked on the base die having a plurality of second conductive vias bonded to the first contacts on the base die and a plurality of second contacts in electrical communication with the second conductive vias.