Tetrakisphenol and non-clathrated curing agent for epoxy resin
AssigneeNippon Soda Co., Ltd.
InventorsHiroshi Suzuki, Satoru Abe
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AssigneeNippon Soda Co., Ltd.
InventorsHiroshi Suzuki, Satoru Abe
Estimating the term…
The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures. The curative is characterized by being a clathrate comprising a tetrakisphenol compound represented by a general formula (I), wherein X represents (CH2)n, wherein n is 0, 1, 2 or 3, and R1 to R8 each represents hydrogen, a lower alkyl, optionally-substituted phenyl, halogeno or a lower alkoxy, and the curing accelerator is characterized by being a clathrate comprising a tetrakisphenol compound represented by the general formula (I) shown above and a compound accelerating the curing of a compound which reacts with the epoxy group of an epoxy resin to cure the resin.
An epoxy resin composition comprising:
A method for curing an epoxy resin comprising a step of mixing a non-clathrated curing agent reacting with an epoxy group of the epoxy resin to cure the resin and a tetrakisphenol compound represented by a general formula (I) as a curing accelerator catalyst with a non-curing epoxy resin,
An epoxy resin composition comprising a non-curing epoxy resin, and a clathrate comprising a tetrakisphenol compound represented by a general formula (I) and a compound reacting with an epoxy group of the epoxy resin to cure the resin;
A method for curing an epoxy resin composition comprising the steps of:
Dependencies are inferred from the claim text.