Supercritical fluid-based cleaning compositions and methods
AssigneeAdvanced Technology Materials, Inc.
InventorsJeffrey F. Roeder, Thomas H. Baum, Matthew Healy, Chongying Xu
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Abstract
Compositions and methods employing supercritical fluids, e.g., supercritical carbon dioxide, for removal of unwanted material from microelectronic device structures and process equipment. One composition of such type, having utility for removing flux and solder perform surface films, includes supercritical fluid, e.g., supercritical CO2, and organic co-solvent, e.g., xylene. Another composition of such type having utility for removal of metals, metal oxides, metal-containing post-etch residues and CMP particles from semiconductor substrates includes supercritical fluid and at least one β-diketone.
Claims68
A cleaning composition comprising supercritical carbon dioxide, an organic co-solvent, and boric acid, wherein said organic co-solvent comprises a solvent selected from the group consisting of:
- xylene, N-methylpyrrolidone, N-phenylpyrrolidone, dimethylsulfoxide, sulfolane, catechol, ethyl lactate, acetone, methyl ethyl ketone, monoethanolamine, butyrol lactone, diglycol amine, γ-butyrolactone, butylene carbonate, ethylene carbonate, propylene carbonate, beta-diketone, and combinations thereof.
A cleaning composition comprising supercritical fluid and xylene, wherein said cleaning composition is useful for removing unwanted solder flux residue material and surface films from integrated circuitry structures and solder preforms having such unwanted material thereon.
A cleaning composition comprising a supercritical fluid, at least one β-diketone, a co-solvent and boric acid.
A method of removing unwanted material from integrated circuitry structures and solder preforms having such unwanted material thereon, said method comprising contacting said unwanted material with a cleaning formulation for sufficient time to at least partially remove said unwanted material wherein said cleaning formulation comprises supercritical carbon dioxide, an organic co-solvent, and boric acid, wherein said organic co-solvent comprises a solvent selected from the group consisting of:
- xylene, N-methylpyrrolidone, N-phenylpyrrolidone, dimethylsulfoxide, sulfolane, catechol, ethyl lactate, acetone, methyl ethyl ketone, monoethanolamine, butyrol lactone, diglycol amine, γ-butyrolactone, butylene carbonate, ethylene carbonate, propylene carbonate, beta-diketone, and combinations thereof.
A method of removing unwanted solder flux residue material and surface films from integrated circuitry structures and solder preforms having such unwanted material thereon, said method comprising contacting said unwanted material with a cleaning formulation for sufficient time to at least partially remove said unwanted material and wherein said cleaning formulation comprises supercritical fluid and xylene.
A method of making a packaged integrated circuit (IC) product, comprising fabricating an IC chip, affixing the IC chip to packaging structure with an array of solder preform balls in contact with a flux, applying heat to the array of solder perform balls to effect solder bonding of the IC chip to the packaging structure, and cleaning solder-bonded regions by contacting same with a cleaning composition comprising supercritical fluid and xylene.
A method of cleaning a semiconductor substrate for removal of unwanted material thereon, wherein said unwanted material comprises material selected from the group consisting of metals, metal oxides, metal-containing post-etch residues, and CMP particles, said method comprising contacting the semiconductor substrate with a cleaning composition for sufficient time to at least partially remove said unwanted material from said semiconductor substrate, wherein said cleaning composition comprises a supercritical fluid, a co-solvent, boric acid, and at least one β-diketone.
A cleaning composition consisting of supercritical carbon dioxide, an organic co-solvent, and boric acid.
Dependencies are inferred from the claim text.