# US 7,482,686 B2 · Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,482,686 B2 - Document ID: US7482686B2 - Status: Granted - Kind: B2 - Application number: 10/870,929 - Filed: 2004-06-21 - Published: 2005-12-22 - Granted: 2009-01-27 - Earliest claimed: 2004-06-21 - Assignees: Braodcom Corporation - Inventors: Sam Ziqun Zhao; Reza-ur Rahman Khan - Web page: https://patentgrep.com/patent/US7482686B2 ## CPC - H10W 76/47: Solid or gel fillings - H10W 40/778: {in encapsulations} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 74/117: {the substrate having spherical bumps for external connection} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/5473: {multiple bond wires connected to a common bond pad} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A die-up array integrated circuit (IC) device package and method of making the same is presented. A frame body has opposing first and second surfaces and a central opening that is open at the first and second surfaces. The second frame body surface is mounted to a first stiffener surface. An IC die is mounted to the first stiffener surface within the central opening through the frame body. A planar lid has opposing first and second surfaces. The second lid surface is coupled to the first frame body surface. A first substrate surface is coupled to a second stiffener surface. An array of electrically conductive terminals is coupled to a second substrate surface. The stiffener, frame body, and lid form an enclosure structure substantially enclosing the IC die. The die enclosure spreads heat from the IC die, and shields EMI emanating from and radiating toward the IC die. ## Claims ### Claim 1 A die-up array integrated circuit (IC) device package, comprising: a stiffener having opposing first and second surfaces; a frame body having opposing first and second surfaces, said frame body further having a central opening that is open at said first and second surfaces of said frame body, wherein said second surface of said frame body is coupled to said first surface of said stiffener; an IC die mounted to said first surface of said stiffener within said central opening; a planar lid having opposing first and second surfaces, wherein said second surface of said lid is coupled to said first surface of said frame body; and wherein said second surface of said lid overlaps said central opening through said frame body; and a substrate having a first surface coupled to said second surface of said stiffener, wherein a plurality of contact pads on said first surface are electrically connected through said substrate to an array of electrically conductive terminals on a second surface of said substrate; wherein said stiffener, said frame body, and said lid form an enclosure structure that substantially encloses said IC die, wherein said stiffener further comprises: a first portion having at least one electrically conductive plated area patterned on said first surface in one or more areas in electrical contact with said frame body; and a second portion separated from said first portion by a channel through said stiffener, wherein said second portion is electrically isolated from said first portion. ### Claim 2 (depends on 1) The package of claim 1, wherein said enclosure structure spreads heat from said IC die during operation of said IC die. ### Claim 3 (depends on 1) The package of claim 1, wherein said enclosure structure shields electromagnetic interference (EMI) emanating from said IC die and EMI radiating toward said IC die from outside the package. ### Claim 4 (depends on 1) The package of claim 1, wherein said central opening through said frame body has a substantially rectangular cross-section. ### Claim 5 (depends on 1) The package of claim 1, further comprising: at least one electrically conductive plated area deposited on said first surface of said stiffener in areas in contact with one or more wire bonds. ### Claim 6 (depends on 1) The package of claim 1, further comprising: at least one wire bond that couples at least one bond pad on a surface of said IC die to said first surface of said stiffener, whereby said enclosure structure is coupled to an electrical potential. ### Claim 7 (depends on 6) The package of claim 6, wherein said at least one bond pad is a ground pad, whereby said enclosure structure is coupled to a ground potential. ### Claim 8 (depends on 1) The package of claim 1, wherein said stiffener includes at least one opening that is open at said first and second surfaces of said stiffener, the package further comprising: at least one wire bond that couples at least one bond pad on a surface of said IC die to said first surface of said substrate through said at least one opening through said stiffener. ### Claim 9 (depends on 1) The package of claim 1, wherein a peripheral dimension of said frame body substantially coincides with a peripheral dimension of said stiffener. ### Claim 10 (depends on 1) The package of claim 1, wherein said IC die is centrally mounted on said first surface of said stiffener. ### Claim 11 (depends on 1) The package of claim 1, wherein said array of electrically conductive terminals includes one of an array of solder balls, pins, or pads. ### Claim 12 (depends on 1) The package of claim 1, further comprising: an encapsulating material that encapsulates said IC die. ### Claim 13 (depends on 12) The package of claim 12, further comprising: an air gap between said encapsulating material and said second surface of said lid. ### Claim 14 (depends on 12) The package of claim 12, wherein said frame body further comprises: at least one groove formed in said first surface of said frame body, wherein said groove and said second surface of said lid form an opening through said frame body that is open at said first surface of said frame body and said central opening. ### Claim 15 (depends on 14) The package of claim 14, wherein said opening through said frame body is configured to facilitate release of an air pressure inside said enclosure structure. ### Claim 16 (depends on 1) The package of claim 1, wherein said first surface of said frame body includes a recessed inner edge portion. ### Claim 17 (depends on 16) The package of claim 16, wherein said lid is recess-mounted in said recessed inner edge portion of said frame body. ### Claim 18 (depends on 17) The package of claim 17, wherein said first surface of said lid is substantially flush with said first surface of said frame body. ### Claim 19 (depends on 17) The package of claim 17, wherein said first surface of said lid protrudes relative to said first surface of said frame body.