Chip to Chip optical interconnect
AssigneeInternational Business Machines Corporation
InventorsPunit P. Chiniwalla, Philip Hobbs, Theodore G. van Kessel
Life of this patent
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Abstract
An apparatus for optical communication is provided. The apparatus includes a first waveguide formed on a first surface and a second waveguide formed on a second surface. The first and second surfaces are bonded together to form an air gap between the first and second surfaces and diffraction gratings of the first and second waveguides are facing each other. A third waveguide is formed on a third surface, and the third surface is bonded to the second surface so an air gap exists between the third and second surface and diffraction gratings of the third and second wave guides face each other. The light beam passes from the second wave guide across the air gap and into the third waveguide.
Claims22
A method for chip to chip communication, the method comprising:
- forming a first waveguide on a first surface;
- forming a second waveguide on a second surface;
- bonding the first surface to the second surface so an air gap exists between the first and second surface and diffraction gratings of the first and second wave guides face each other;
- passing a light beam through the first waveguide, across the air gap and into the second waveguide;
- forming a third waveguide on a third surface;
- and
- bonding the third surface to the second surface so an air gap exists between the third and second surface and diffraction gratings of the third and second wave guides face each other;
- wherein the light beam passes from the second wave guide across the air gap and into the third waveguide.
An apparatus for optical communication comprising:
- a first waveguide formed on a first surface;
- and
- a second waveguide formed on a second surface;
- wherein the first and second surfaces are bonded together to form an air gap between the first and second surfaces and diffraction gratings of the first and second waveguides are facing each other;
- and
- a third waveguide formed on a third surface;
- wherein the third and second surfaces are bonded together to form an air gap between the first and second surfaces and diffraction gratings of the third and second waveguides are facing each other.
An apparatus for optical chip to chip communication comprising:
- a first waveguide formed on an outer area of a first surface;
- a second waveguide formed on an outer area of a second surface, the second waveguide having at least two diffraction grating sections;
- and
- a third waveguide formed on an outer area of a third surface;
- wherein the outer areas of the first and third surfaces are bonded to the outer area of the second surface so an air gap exists between the outer areas of the first and second surfaces and the third and second surfaces, a diffraction grating section of the first waveguide is facing a first diffraction grating of the second waveguide and a diffraction grating of the third surface is facing a second diffraction grating of the second surface.
An apparatus for optical chip to chip communication comprising:
- a first waveguide formed on a first surface;
- and
- a second waveguide formed on a second surface;
- wherein the first and second surfaces are bonded together to form an air gap between the first and second surfaces and diffraction gratings of the first and second waveguides are facing each other, the first waveguide having three elements;
- and
- a third waveguide formed on a third surface;
- wherein the third and second surfaces are bonded together to form an air gap between the first and second surfaces and diffraction gratings of the third and second waveguides are facing each other, the third waveguide having three elements.
Dependencies are inferred from the claim text.