EMI shielding package and method for making the same

An electronic component package assembly, comprising:

• a substrate of said electronic component package assembly;
• a plurality of electronic components installable on said substrate;
• an Electronmagnetic Interference (EMI) shielding means configured to cover at last one electronic component out of said plurality of electronic components, at least one accessible hole formed through said EMI shielding means so as spatially communicate covered space between said EMI shielding means and said substrate with space outside EMI shielding means;
• and
• sealing material applied to seal said plurality of electronic components and said EMI shielding means, and applied to seal said at least one component in said EMI shielding means via passage of said sealing material into said covered space of space of said EMI shielding means through said at least one accessible hole;
• wherein a diameter of said at least one accessible hole is calculated based on the following formula:
• D≦1/20*λmin;
• wherein D represents said diameter of said at least one accessible hole, and λmin represents the speed of light/maximum frequency shielding by said EMI shielding means.

An Electromagnetic Interference (EMI) shielding package assembly comprising:

• a substrate with a plurality of electronic components fixed thereon;
• a metal cap comprising a base panel and a plurality of walls extending from the base panel, the walls attaching to the substrate via a plurality of pads, wherein the metal cap covers selected one or more of the electronic components for shielding;
• and
• a potting compound sealing the electronic components and the metal cap;
• wherein the pads are mount on bottom edges of the walls and set in equal interval, and wherein the base panel of the metal cap defines a plurality of holes, and a diameter of the holes is calculated based on the following formula:
• D≦1/20*λmin, wherein D represents the diameter of the holes, and λmin represents the speed of light/maximum frequency of EMI.