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US 7,480,145 B2Granted
Thin, passive cooling system
AssigneeApple Inc.
InventorIhab A. Ali
Life of this patent
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Abstract
A system includes a power source and a heat-shield mechanism which encloses the power source. This heat-shield mechanism includes a 3-dimensional housing that defines a cavity in which the power source resides, and a plate that is positioned to cover an opening to the cavity that is defined by an edge of the housing. Note that the housing contains three layers in which a second layer is sandwiched between a first layer and a third layer. This second layer has a first anisotropic thermal conductivity. Furthermore, the plate includes a material having a second anisotropic thermal conductivity.
Claims20
A system, comprising:
- a power source;
- and
- a heat-shield mechanism which encloses the power source,
- wherein the heat-shield mechanism includes:
- a housing which is 3-dimensional, wherein the housing defines a cavity in which the power source resides, wherein an edge of the housing defines an opening to the cavity, wherein the housing contains three layers in which a second layer is sandwiched between a first layer and a third layer, and wherein the second layer has a first anisotropic thermal conductivity;
- and
- a plate which includes a material having a second anisotropic thermal conductivity, wherein the plate is positioned to cover the opening to the cavity thereby enclosing the power source.
4 more elements
Dependencies are inferred from the claim text.