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AssigneeInternational Business Machines Corporation
InventorsHiroyuki Takenoshita, Hideki Sasaki, Tomohisa Nakamura, Seiji Koyama
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An electronic equipment of the present invention includes housings and, a substrate, electronic components mounted on the substrate, a heatsink which is connected to the electronic component, connection means for connecting the heatsink to the housing depending on a temperature in the housing and for forming a heat conduction path from the electronic component to the housing, and a fan for flowing cooling air into the housing. The substrate, the electronic component, the heatsink, the connection means, and the fan are arranged in the housing. Depending on the temperature, the connection means promotes heat transfer from the heatsink to the housing, which has a large radiation area, in addition to a cooling (radiation) operation using the fan. As a result, the cooling of the electronic component inside the housing is promoted during operation. By this cooling effect, the present invention improves reliability and safety against heat generation of the electronic component (in particular, a central processing unit).
An electronic device, comprising:
A method of cooling an electronic device that includes a housing having a metal wall portion, a substrate, an electronic component mounted on the substrate, and a heatsink which is connected to the electronic component and includes a sheet metal plate, wherein the substrate, the electronic component and the heatsink are arranged in the housing, the method comprising the steps of:
A method of cooling an electronic device that includes a housing having a metal wall portion, a substrate, an electronic component mounted on the substrate, and a heatsink which is connected to the electronic component and includes a sheet metal plate, wherein the substrate, the electronic component and the heatsink are arranged in the housing, the method comprising the steps of:
Dependencies are inferred from the claim text.