US 7,480,006 B1Granted

Optical package for image sensor with integrated heater

AssigneePixim, Inc.

InventorMichael Frank

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Abstract

An integrated circuit package for an image sensor chip includes an integrated heater element. In one embodiment, the integrated circuit package includes a substrate including a first surface disposed to receive an image sensor chip and a second surface having an array of contact terminals formed thereon and a heater element. The heater element has a first terminal and a second terminal coupled to a first contact terminal and a second contact terminal. The heater element is positioned on the first surface of the substrate and underneath the sensor area of the image sensor chip to be assembled in the package. The heater element provides heating of the sensor area of the image sensor chip when a first voltage is applied across the first contact terminal and the second contact terminal. An ESD protection resistor can be coupled between the first terminal and the second terminal of the heater element.

Claims13

Dependent claims

An integrated circuit package for an image sensor chip, the image sensor chip including a sensor area for sensing incident light and a circuitry area, the package comprising:

a substrate including a first surface for receiving an image sensor chip and a second surface having an array of contact terminals formed thereon;
and
a heater element having a first terminal and a second terminal coupled to a first contact terminal and a second contact terminal, respectively, of the array of contact terminals, the heater element being positioned on the first surface of the substrate and directly underneath the sensor area of the image sensor chip to be assembled in the package, the image sensor chip to be placed directly on the heater element,
wherein the heater element provides heating of the sensor area of the image sensor chip when a first voltage is applied across the first contact terminal and the second contact terminal;
and
wherein the image sensor chip is attached directly to the heater element and the first surface of the substrate using an epoxy glue so that the heater element is sandwiched directly between the sensor area of the image sensor chip and the first surface of the substrate to provide direct and localized heating of the sensor area of the image sensor chip.

3 more elements

Dependencies are inferred from the claim text.