Method for manufacturing surface acoustic wave device and surface acoustic wave device
AssigneeMurata Manufacturing Co., Ltd.
InventorYuichi Takamine
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Abstract
A method for manufacturing a surface acoustic wave device includes the steps of forming an IDT electrode, a first wiring pattern, and a third wiring pattern on a piezoelectric substrate, forming an insulating film covering the IDT electrode and the wiring patterns, forming a photosensitive resin film, obtaining the photosensitive resin film, and forming a second wiring pattern on an insulating layer composed of the insulating film and the photosensitive resin film laminated on the insulating film so that the second wiring pattern three-dimensionally crosses the first wiring pattern.
Claims10
A method for manufacturing a surface acoustic wave device comprising the steps of:
- forming an IDT electrode and a first wiring pattern on a piezoelectric substrate;
- forming an insulating film to cover the IDT electrode and the first wiring pattern on the piezoelectric substrate after the IDT electrode and the first wiring pattern are formed;
- applying a photosensitive resin on the insulating film so as to form a photosensitive resin layer;
- patterning the photosensitive resin layer;
- etching a portion of the insulating film such that the insulating film remains on the IDT electrode;
- and
- forming a second wiring pattern on the insulating layer composed of the insulating film and the photosensitive resin film provided on the insulating film in a region other than a region where the IDT electrode is provided.
A surface acoustic wave device comprising:
- a piezoelectric substrate;
- at least one IDT electrode provided on the piezoelectric substrate;
- a first wiring pattern provided on the piezoelectric substrate;
- an insulating film arranged to cover the IDT electrode and the first wiring pattern;
- and
- a photosensitive resin film provided on the insulating film over the first wiring pattern but not on the IDT electrode;
- wherein
- a second wiring pattern is provided on the insulating layer having a laminated structure composed of the insulating film and the photosensitive resin film.
Dependencies are inferred from the claim text.