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US 7,479,793 B2Granted
Apparatus for testing semiconductor test system and method thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsByung-Wook Park, Byeong-Hwan Cho, Young-Dong Nam, Bo-Yeon Kim
Life of this patent
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Abstract
A test system includes a tester configured to perform a test operation on a semiconductor wafer; an interface unit configured to interface between the tester and the semiconductor wafer; and a conductive plate configured to provide the interface unit with a current path when the interface unit is determined to be defective.
Claims4
A method of checking a defect of a semiconductor test apparatus for testing a wafer comprising:
- providing a pogo connector connected to a tester of the semiconductor test apparatus;
- connecting a probe card to the pogo connector and to a test pattern formed on a wafer to test whether the semiconductor test apparatus is defective;
- replacing the probe card with a probe card for test having a conductive plate when the test result indicates that the semiconductor test apparatus is malfunctioning;
- testing the semiconductor test apparatus using the replaced probe card for test;
- and
- determining whether either one of the probe card and the pogo connector is defective, based on the test result,
- wherein the probe card is determined to be defective when a current obtained through the probe card for test is within an allowed range;
- and the pogo connector is determined to be defective when a current obtained through the probe card for test deviates from the allowed range.
5 more elements
Dependencies are inferred from the claim text.