Light-emitting diode package structure, cold cathode flourescent lamp and photoluminescent material thereof
AssigneeLighthouse Technology Co., Ltd.
InventorsChih-Chin Chang, Hsiang-Cheng Hsieh, Teng-Huei Huang
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Abstract
An LED package structure including a carrier, an LED chip, an encapsulant and a PL material is provided, wherein the LED chip is disposed on the carrier for emitting light. The encapsulant encapsulates the LED chip. The PL material is distributed in the encapsulant. The PL material is suitable for being excited by the light emitted from the LED chip and scattering the light. Moreover, the present invention provides a novel PL material with a molecular formula of WmMon(Y,Ce,Tb,Gd,Sc)3+t+u(Al,Ga,Tl,In,B)5+u+2v(O,S,Se)12+2t+3u+3v+3m+3n: Ce3+, Tb3+, wherein 0<t<5 and 0<m, n, u, v<15.
Claims12
A light-emitting diode (LED) package structure, comprising:
- a carrier;
- an LED chip disposed on the carrier and suitable for emitting light;
- an encapsulant for encapsulating the LED chip on the carrier, and
- a photoluminescent material distributed in the encapsulant, wherein the molecular formula of the photoluminescent material is given by:
- WmMon(Y,Ce,Tb,Gd,Sc)3+t+u(Al,Ga,Tl,In,B)5+u+2v(O,S,Se)12+2t+3u+3v+3m+3n:
- Ce3+, Tb3+, wherein 0<t<5 and 0<m, n, u, v<15.
Dependencies are inferred from the claim text.